Siemens acquires Canopus AI: Supercharging semiconductor manufacturing with AI-powered metrology

Siemens acquires Canopus AI: Supercharging semiconductor manufacturing with AI-powered metrology

Siemens acquires Canopus AI to advance semiconductor manufacturing with AI-powered metrology and inspection, boosting precision, efficiency, and yield.
Calibre IC Manufacturing in 2025: The year’s biggest news

Calibre IC Manufacturing in 2025: The year’s biggest news

Read about 2025 highlights from Siemens Calibre IC Manufacturing group, including advances in computational metrology, monotonic machine learning, AI, EUV and GPU acceleration
ESD verification in 3D ICs: Navigating unseen risks and new realities

ESD verification in 3D ICs: Navigating unseen risks and new realities

Discover best practices for automated 3D IC ESD verification using Calibre 3DPERC. Learn how to address the unique challenges of ESD protection in advanced 3D IC designs and ensure system-level reliability.
Calibre IC Design in 2025: AI, 3D IC advancement and shift-left strategies drive verification excellence

Calibre IC Design in 2025: AI, 3D IC advancement and shift-left strategies drive verification excellence

Read about 2025 IC Design highlights from Siemens Calibre, including AI-powered verification and debug, 3D IC innovations, and shift-left strategies supporting accelerated tapeouts.
Securing your silicon: Why automated IP integrity is non-negotiable in modern SoC design

Securing your silicon: Why automated IP integrity is non-negotiable in modern SoC design

Ensure IP integrity in your SoC designs. Discover how Calibre IP Checker detects hidden IP modifications, prevents costly re-spins and accelerates tape-out.
6 frequent design rule checking errors every IC designer should know – and how Calibre nmDRC helps you avoid them

6 frequent design rule checking errors every IC designer should know – and how Calibre nmDRC helps you avoid them

Learn about some common design rule checking (DRC) violations in integrated circuit layouts—and how Calibre nmDRC helps engineers catch, analyze and resolve them quickly to ensure first-pass silicon success.
Bridging the gap: Unlock seamless collaboration in IC design with Calibre Connectivity Interface

Bridging the gap: Unlock seamless collaboration in IC design with Calibre Connectivity Interface

Calibre Connectivity Interface (CCI) seamlessly connects EDA tools for advanced IC design verification. It transforms LVS into a powerful data source, enabling critical analyses like parasitic extraction & power integrity.
The IC designers complete guide to design rule checking

The IC designers complete guide to design rule checking

Design rule checking (DRC) ensures IC layouts meet foundry rules. Learn how modern DRC engines like Calibre deliver scalable, sign-off accuracy at advanced nodes
IC visualization: Supercharge debug of hidden parasitic threats with Calibre

IC visualization: Supercharge debug of hidden parasitic threats with Calibre

By Omar Elabd If you’ve ever watched your simulation pass with flying colors, only to see your silicon fail in...
From translator to powerhouse: Calibre V2LVS second generation redefines LVS verification

From translator to powerhouse: Calibre V2LVS second generation redefines LVS verification

Explore second-generation Calibre Verilog-to-LVS: up to 4X faster runtimes, 92% less memory use, smarter debugging and robust SoC verification for advanced digital designs
Design rule checking in today’s integrated circuit design environment

Design rule checking in today’s integrated circuit design environment

Explore integrated circuit design rule checking (DRC) in modern integrated circuit design, from increasing complexity to fast-feedback solutions like Calibre nmDRC Recon. Learn use cases, challenges and future trends.
Boost simulation results with powerful selective net extraction with Calibre xACT

Boost simulation results with powerful selective net extraction with Calibre xACT

By Karen Chow In advanced integrated circuit (IC) design, post-layout parasitic extraction is crucial for accurate performance analysis and optimization....
Safeguarding IC reliability: Calibre PERC’s latch-up guard ring check

Safeguarding IC reliability: Calibre PERC’s latch-up guard ring check

Ensure robust latch-up protection in your ICs with Calibre PERC's comprehensive ESDA verification checks. Identify and resolve issues early, improve reliability, and accelerate time-to-market.
Driving 3D IC innovation with Calibre multiphysics 

Driving 3D IC innovation with Calibre multiphysics 

Explore how Siemens EDA’s multiphysics workflow helps design teams to overcome the thermal, stress and reliability challenges of 3D ICs. Learn why early, integrated analysis with tools like Calibre 3DSTACK and Innovator3D IC is critical to success in advanced chiplet design.
Siemens-imec collaboration reduces stochastic failures in EUV lithography by orders of magnitude in wafer-level experimental validation

Siemens-imec collaboration reduces stochastic failures in EUV lithography by orders of magnitude in wafer-level experimental validation

Siemens stochastic-aware OPC reduces EUV stochastic failures at wafer level for SRAM and logic, validating predictive modeling with experimental data.
Enhancing IC Verification: Smarter solutions for faster, more reliable designs

Enhancing IC Verification: Smarter solutions for faster, more reliable designs

By Jonathan Muirhead Modern chip layouts are more intricate than ever, incorporating a mix of custom and third-party intellectual property...
Revolutionizing 3D IC design with integrated multiphysics verification

Revolutionizing 3D IC design with integrated multiphysics verification

By Yoyo Li The semiconductor landscape is always evolving—sometimes quietly, sometimes at breakneck pace. Today, as integrated circuit designs progress...
How to boost reliability with early-stage reliability checks

How to boost reliability with early-stage reliability checks

By Chun-hsiang Chang The rapid expansion of AI-powered consumer electronics is pushing IC manufacturing to the sub-2 nm frontier. To...
Navigating 3D IC stress: physical realities and best practices for 3D IC reliability

Navigating 3D IC stress: physical realities and best practices for 3D IC reliability

By Shetha Nolke As the semiconductor industry shifts toward heterogeneous 3D ICs, exciting benefits are coming within reach—from smaller footprints...
Ensure power domain compatibility by finding missing level shifters with Insight Analyzer

Ensure power domain compatibility by finding missing level shifters with Insight Analyzer

By Bhanu Pandey Level shifters are essential for safe, reliable mixed-signal IC design—especially as designers deploy more power domains than...
Stress less, innovate more: ensuring 3D IC reliability with Siemens Calibre 3DStress

Stress less, innovate more: ensuring 3D IC reliability with Siemens Calibre 3DStress

The march toward 3D ICs and advanced packaging brings unrivaled performance and integration opportunities—but it also raises new reliability challenges...
Calibre Vision AI: a new era of fast, scalable chip-level DRC debug

Calibre Vision AI: a new era of fast, scalable chip-level DRC debug

By James Paris As chip designs grow more complex and SoCs reach new heights in size and integration, the challenges...
Enhancing EUV lithography resolution at high numerical aperture

Enhancing EUV lithography resolution at high numerical aperture

By Ethan Maguire As the semiconductor industry continues to push the boundaries of feature size and density, the need for...
Overcoming noise challenges in analog and RF circuit design with Calibre PERC net shielding

Overcoming noise challenges in analog and RF circuit design with Calibre PERC net shielding

By Hossam Sarhan Communication has become the backbone of everything from personal routines to industry, and the demand for analog...
Calibre xACT takes a hybrid approach to parasitic extraction

Calibre xACT takes a hybrid approach to parasitic extraction

By Mark Tawfik Parasitic extraction plays a pivotal role in the design and optimization of integrated circuits (ICs). Extraction involves...
Smart strategies for metal fill extraction

Smart strategies for metal fill extraction

By Shehab Ashraf As semiconductor technology continues to scale, the impact of parasitic effects from metal fill structures has become...
Solving inter-domain leakage challenges: Enhancing IC design with Insight Analyzer

Solving inter-domain leakage challenges: Enhancing IC design with Insight Analyzer

By Charlie Olson Design reliability remains a top priority for engineers in the world of semiconductor technology. One critical challenge...
Smarter DRC for complex designs: Accelerating verification with Calibre nmDRC Recon

Smarter DRC for complex designs: Accelerating verification with Calibre nmDRC Recon

By John Ferguson The challenge: Traditional DRC can’t keep up… Increasing complexity and automation in IC design have made traditional...
Easily manage multiple verification jobs with Calibre

Easily manage multiple verification jobs with Calibre

Calibre Multiple Job Submission GUI helps you optimize your IC design verification As the complexity of integrated circuits (ICs) continues...
Siemens shines at the 2025 SPIE Advanced Lithography + Patterning symposium

Siemens shines at the 2025 SPIE Advanced Lithography + Patterning symposium

The SPIE Advanced Lithography + Pattering symposiums were held 23-27 February this year with the usual enthusiastic and sizable attendance...
Solving IR drop and layout bottlenecks: How Calibre DesignEnhancer streamlines IC design

Solving IR drop and layout bottlenecks: How Calibre DesignEnhancer streamlines IC design

By Jeff Wilson As an IC designer, you know that achieving an optimal layout is about more than just meeting...
Transforming pre-layout IC reliability analysis with Siemens Insight Analyzer

Transforming pre-layout IC reliability analysis with Siemens Insight Analyzer

By Matthew Hogan As the industry continues to push the boundaries of what’s possible in IC design, the need for...
Unlocking post-tapeout flow scalability and performance with cloud computing

Unlocking post-tapeout flow scalability and performance with cloud computing

By Bassem Riad As process geometries continue to shrink, computational lithography demands increasingly powerful and abundant CPU resources to support...
Siemens EDA and TSMC partner to advance 3D IC Design

Siemens EDA and TSMC partner to advance 3D IC Design

As the semiconductor industry continues to push the boundaries of innovation, the need for advanced 3D IC design solutions has...
Shift left with Calibre interactive symmetry checking to improve design efficiency

Shift left with Calibre interactive symmetry checking to improve design efficiency

By Sara Khalaf Symmetry plays a crucial role in IC design by ensuring balanced device behavior, minimizing mismatch, and improving...
Navigating ESD challenges in 2.5D/3D ICs: A guide to robust automated verification

Navigating ESD challenges in 2.5D/3D ICs: A guide to robust automated verification

By Dina Medhat Electrostatic discharge (ESD) events cause severe damage to unprotected integrated circuits (ICs). ESD events cause severe damage...
An introduction to advanced verification techniques for IC design symmetry

An introduction to advanced verification techniques for IC design symmetry

By Jonathan Muirhead Integrated circuit (IC) design, particularly for analog and radio frequency (RF) circuits, involves meticulous attention to detail...
Siemens Calibre 3DThermal wins 2024 WEAA award for innovation in 3D IC thermal analysis

Siemens Calibre 3DThermal wins 2024 WEAA award for innovation in 3D IC thermal analysis

Siemens Digital Industries Software’s Calibre® 3DThermal tool was awarded the 2024 AspenCore World Electronics Achievement Award (WEAA) in the EDA/IP/Software...
Dr. Fedor Pikus cultivates engineering talent in Armenia

Dr. Fedor Pikus cultivates engineering talent in Armenia

The semiconductor market depends on the work of talented engineers, but the supply of qualified engineers worldwide hasn’t kept pace...
Shift left in IC design: A holistic strategy for faster, smarter verification

Shift left in IC design: A holistic strategy for faster, smarter verification

By Michael White and David Abercrombie As IC design complexity continues to grow, companies are turning to the shift left...
Tom Quan is now officially retired from TSMC

Tom Quan is now officially retired from TSMC

For those of us in Semiconductor Ecosystem, watching the TSMC OIP (Open Innovation Platform) evolve from a fledgling foundry event...
Enhanced short isolation process for faster circuit verification

Enhanced short isolation process for faster circuit verification

By Ritu Walia Repetitive layout vs. schematic (LVS) runs can significantly delay project timelines. A huge number of shorted nets...
Unveiling the future of 3DIC design with Calibre 3DThermal

Unveiling the future of 3DIC design with Calibre 3DThermal

By Lee Wang The semiconductor industry is undergoing a transformative shift from traditional 2D integrated circuit (IC) designs to more...
Navigating the complex world of resistance extraction for curvilinear shapes in IC designs

Navigating the complex world of resistance extraction for curvilinear shapes in IC designs

By Nada Tarek As integrated circuit (IC) designs continue to push the boundaries of what’s possible, we’re seeing an explosion...
Optimal ESD protection with Calibre PERC and Solido Simulation Suite

Optimal ESD protection with Calibre PERC and Solido Simulation Suite

By Neel Natekar Integrated circuit (IC) reliability engineers face the dual challenge of ensuring robust electrostatic discharge (ESD) protection without...
Cloud Flight Plans enable cost-effective use of the cloud for peak productivity

Cloud Flight Plans enable cost-effective use of the cloud for peak productivity

By Chris Clee You might ask, “What on Earth is a Cloud Flight Plan?” It’s a collection of best practices...
Faster design verification with Calibre nmLVS Recon Compare

Faster design verification with Calibre nmLVS Recon Compare

By Wael ElManhawy Layout versus schematic (LVS) comparison is a fundamental step in integrated circuit (IC) design verification. It ensures...
Cracking the code: ensuring reliability and performance in IC design with EM/IR analysis

Cracking the code: ensuring reliability and performance in IC design with EM/IR analysis

By Karen Chow and Joel Mercier Integrated circuits (ICs) are everywhere, powering everything from washing machines and TVs to medical...
Shift left for more efficient block design and chip integration

Shift left for more efficient block design and chip integration

Block/chip integration is a lot more complicated than it gets credit for. On the face of it, chip integration just...
Speeding up early design rule checking with Calibre nmDRC Recon

Speeding up early design rule checking with Calibre nmDRC Recon

By John Ferguson and Nermeen Hossam Chip designers are very aware of how time-consuming early design rule checking (DRC) can...
Automated analysis-based layout enhancements reduce power grid voltage drops during place & route: A case study with Google

Automated analysis-based layout enhancements reduce power grid voltage drops during place & route: A case study with Google

By Jeff Wilson Power isn’t just a small factor in the IC design arena—it’s a cornerstone. Design teams work to...
Accelerate IP design cycles and reduce costs with Calibre design stage verification

Accelerate IP design cycles and reduce costs with Calibre design stage verification

By Terry Meeks In the fast-paced world of semiconductor design, time is a critical asset. One way IC designers save...
Balancing performance vs. debuggability in LVS circuit verification

Balancing performance vs. debuggability in LVS circuit verification

By Wael ElManhawy Circuit verification engineers face ever more challenges as semiconductor technology evolves towards smaller process nodes and integrated...
A new physical verification reporting solution smooths the on-time tapeout effort

A new physical verification reporting solution smooths the on-time tapeout effort

By Richard Yan In the intricate world of system-on-chip (SoC) development, Physical Verification (PV) reports serve as vital checkpoints throughout...
How to verify well layer connectivity with soft checks

How to verify well layer connectivity with soft checks

By Terry Meeks In the landscape of modern IC chip verification, ensuring the connectivity from diffusion layers to well regions...
AI/ML rules at the 2024 SPIE Advanced Lithography + Patterning symposium

AI/ML rules at the 2024 SPIE Advanced Lithography + Patterning symposium

The SPIE Advanced Lithography + Pattering symposiums were held from 25-29 February this year with enthusiastic and sizable attendance. The...
Unlocking the future with a digital twin for semiconductor manufacturing

Unlocking the future with a digital twin for semiconductor manufacturing

By Srividya Jayaram In semiconductor manufacturing, staying ahead means embracing smarter processes. The rise in demand and the need to...
Using a shift left strategy to address block/chip design challenges during design-stage verification

Using a shift left strategy to address block/chip design challenges during design-stage verification

By David Abercrombie For IC designers, striking the right balance between tight deadlines and limited resources is a constant challenge....
How to get accurate inductance extraction for superconductor ICs

How to get accurate inductance extraction for superconductor ICs

By Hossam Sarhan and Dusan Petranovic Supporting the high performance and reliability needed for artificial intelligence (AI), data centers and...
The secret to Calibre software quality – AnaCov, our in-house code coverage analysis tool

The secret to Calibre software quality – AnaCov, our in-house code coverage analysis tool

By Mustafa Naeem, Ahmed Tahoon, Omar Ragi, and Reem El-Adawi In the realm of software testing, accurately tracking and analyzing...
Unraveling the 3DIC shift left strategy: Navigating the world of multi-dimensional ICs

Unraveling the 3DIC shift left strategy: Navigating the world of multi-dimensional ICs

By John Ferguson IC design’s evolution continues to push the boundaries of Moore’s law to new heights. One of the...
Mastering parasitic extraction at the 3 nm process node

Mastering parasitic extraction at the 3 nm process node

By Dilan Heredia and Karen Chow Designing integrated circuits (ICs) for the 3 nm process node poses challenges never seen...
Why PID issues matter to IC chip designers, and how to combat them

Why PID issues matter to IC chip designers, and how to combat them

By Derong Yan Integrated circuit (IC) chip designers are constantly striving to meet ever-increasing standards of reliability and performance in...
Shifting left with Calibre solutions: Enhancing IP design flow efficiency and design quality

Shifting left with Calibre solutions: Enhancing IP design flow efficiency and design quality

By Terry Meeks Designing integrated circuits (ICs) is a multifaceted task that requires the integration of various components, including intellectual...
Revolutionizing software testing: Introducing TCP-Net++

Revolutionizing software testing: Introducing TCP-Net++

By Mohamed Abdelkarim and Reem El Adawi In the dynamic world of software development, balancing speedy delivery with quality assurance...
Streamlining IC design verification with Calibre nmLVS Recon

Streamlining IC design verification with Calibre nmLVS Recon

By Kesmat Shahin As integrated circuits (ICs) become more complex, meeting tapeout schedules has become increasingly challenging. Statistics from industry...
3DICs and the multi-physics challenge

3DICs and the multi-physics challenge

By John Ferguson Design teams have known since, well, pretty much forever that mechanical stresses and temperature changes can affect...
Elevating user experience with UX maturity models

Elevating user experience with UX maturity models

By Kirolos George and Reem El Adawi In today’s digital landscape, user experience (UX) plays a crucial role in the...
Inspiring the next generation of EDA engineers

Inspiring the next generation of EDA engineers

As the semiconductor market grows, so does the need for qualified engineers throughout the semiconductor ecosystem. Of course, the supply...
How to extend DTCO for today’s competitive IC landscape

How to extend DTCO for today’s competitive IC landscape

By Le Hong As semiconductor components continue to shrink, the challenges associated with design-for-manufacturing (DFM) and design-technology co-optimization (DTCO) increase....
Sanity check: Will automated fill back-annotation help?

Sanity check: Will automated fill back-annotation help?

By James Paris Hey there, custom integrated circuit (IC) design engineers! If you’re knee-deep in the world of IC design,...
Streamlining semiconductor verification with the Calibre Interactive interface

Streamlining semiconductor verification with the Calibre Interactive interface

By Slava Zhuchenya In the world of semiconductors, creating and verifying IC designs is no cakewalk. It’s a complex dance...
IC designers: let’s talk about shift left strategies

IC designers: let’s talk about shift left strategies

By John Ferguson In the constantly evolving world of electronics, where demands are high for more powerful, efficient, and reliable...
Transistor-level EMIR analysis from custom design tools? It’s all about flexibility!

Transistor-level EMIR analysis from custom design tools? It’s all about flexibility!

By Roger Kang How do you run transistor-level electromigration and voltage drop (EMIR) analysis—command line or an interactive invocation GUI?...
Save yourself the time—here’s a way for you to view native block instances from a full-chip context

Save yourself the time—here’s a way for you to view native block instances from a full-chip context

By Ritu Walia Imagine this: You primarily work on the design of a sub-block of an application-specific layout design, or...
Calibre PERC checks meet Calibre RVE default views: A match made in debugging heaven?

Calibre PERC checks meet Calibre RVE default views: A match made in debugging heaven?

By Neel Natekar As technology node scaling continues, integrated circuit (IC) designers are facing increasing physical verification challenges due, in...
A recap of Calibre at DAC 2023

A recap of Calibre at DAC 2023

DAC is back! At least was the feeling on the floor, judging by the number of attendees we talked to,...
Updating a Calibre DesignEnhancer via insertion kit is fast and easy!

Updating a Calibre DesignEnhancer via insertion kit is fast and easy!

By Jimmy Tien The Calibre® DesignEnhancer Via use model provides an automated via insertion process based on foundry design rule...
Optimize metal fill insertion while protecting critical nets and devices…automatically!

Optimize metal fill insertion while protecting critical nets and devices…automatically!

By Dina Medhat Context-aware physical verification (PV) is a relatively new addition to traditional PV flows, but it has quickly...
Are you a C++ developer or programmer? You may want to read this…

Are you a C++ developer or programmer? You may want to read this…

By day, Fedor Pikus is head of the Advanced Projects Team in Siemens Digital Industries Software. His responsibilities include planning...
Calibre IC manufacturing research for what comes next

Calibre IC manufacturing research for what comes next

By Germain Fenger Director of Product Management RET modeling, Calibre Semiconductor Manufacturing Solutions There is no rest in semiconductor manufacturing....
Introducing Calibre DesignEnhancer design-stage layout optimization!

Introducing Calibre DesignEnhancer design-stage layout optimization!

By Jeff Wilson Introduced in early 2023, the Calibre DesignEnhancer tool is part of a growing suite of shift-left tools...
AUA students meet Siemens EDA!

AUA students meet Siemens EDA!

By Armen Asatryan On June 14, a group of twelve students from the American University of Armenia (AUA), several faculty...
What’s all the fuss about shift left?

What’s all the fuss about shift left?

By Michael White and David Abercrombie In recent months, it seems as though everyone’s been talking about shift left as...
Cross-platform database validation: Don’t add applications without it!

Cross-platform database validation: Don’t add applications without it!

By James Paris The OASIS* database format is a widely used industry standard in electronic design automation (EDA) software for...
Why take chances with your PV job setups when a winning alternative is available?

Why take chances with your PV job setups when a winning alternative is available?

By Richard Yan Are you interested in optimizing your integrated circuit (IC) physical verification (PV) flows? How does automating the...
How can I run reliability checks early in the design cycle?

How can I run reliability checks early in the design cycle?

By Hossam Sarhan and Alexandre Arriordaz With the increasing complexity of design layouts and shorter tapeout cycles, waiting until signoff...
Siemens EDA celebrates 20 years of collaboration with imec

Siemens EDA celebrates 20 years of collaboration with imec

By Germain Fenger, Director of Product Management RET modelingCalibre Semiconductor Manufacturing solutions This year marks the 20th anniversary of the...
First out of the (3DIC) box: How Siemens EDA is using the TSMC 3Dblox standard to change 3DIC verification

First out of the (3DIC) box: How Siemens EDA is using the TSMC 3Dblox standard to change 3DIC verification

By John Ferguson In recognition of the growing need for a more holistic approach to three-dimensional integrated circuit (3DIC) design,...
A novel methodology for EM assessment in on-power grids can improve power, time-to-market, and design cost

A novel methodology for EM assessment in on-power grids can improve power, time-to-market, and design cost

By Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy Achieving an accurate assessment of electromigration (EM)-induced failure is essential to developing a...
The secret superpower of early design verification

The secret superpower of early design verification

By Kesmat Shahin How many times, as you traversed across design stages and ran countless iterations, have you wished that...
Help! I’m not an ESD expert! Reducing ESD verification complexity

Help! I’m not an ESD expert! Reducing ESD verification complexity

By Abdellah Bakhali If you’re not an electrostatic discharge (ESD) expert (and let’s face it, most of us aren’t), verifying...
Automated common resistance checking…it’s the smart thing to do!

Automated common resistance checking…it’s the smart thing to do!

By Hossam Sarhan Work smarter, not harder. Isn’t that what everyone is always telling you? Of course, it’s excellent advice,...
A software migration that improves productivity? The Calibre Interactive tool has a (new) GUI for that…

A software migration that improves productivity? The Calibre Interactive tool has a (new) GUI for that…

By Slava Zhuchenya Software migration can be a dreaded endeavor, especially for electronic design automation (EDA) tools that design companies...
Find high resistance faster in P2P violations with interactive P2P analysis

Find high resistance faster in P2P violations with interactive P2P analysis

By Slava Zhuchenya So your net trace has too much parasitic resistance. Where is it coming from? You ran your...
A new method of scaling and efficiency for the semi-manufacturing flow

A new method of scaling and efficiency for the semi-manufacturing flow

By Beth Martin Calibre sets sail on Kubernetes While most Calibre semi-manufacturing jobs still run on on-premises compute clusters using...
Abracadabra! Clearing shorts before full-chip implementation

Abracadabra! Clearing shorts before full-chip implementation

By James Paris and Armen Asatryan  Automated short checking during implementation lets design teams quickly find and fix these errors...
Fast, efficient, productive? Your early-stage IC design physical verification can be all that…

Fast, efficient, productive? Your early-stage IC design physical verification can be all that…

By John Ferguson and Nermeen Hossam With each new process node comes more complex requirements needed to ensure working silicon. ...
Infineon and Siemens collaborate for innovation

Infineon and Siemens collaborate for innovation

By Karen Chow When Infineon needed to select a field solver for the development of their next-generation power semiconductor products,...
mPower power integrity analysis solution recognized for innovation and market impact

mPower power integrity analysis solution recognized for innovation and market impact

By Joe Davis Sponsored by France’s ElectroniqueS magazine, the Electrons d’Or Award program identifies the most innovative products of the...
Struggling to verify the reliability of your multiple-power-domain designs?

Struggling to verify the reliability of your multiple-power-domain designs?

By Hossam Sarhan With the growing complexity of system-on-chip designs and technology scaling, multiple power domains are needed to optimize...
TSMC OIP Ecosystem Forum 2022 all wrapped up, but not gone yet…

TSMC OIP Ecosystem Forum 2022 all wrapped up, but not gone yet…

By Calibre Design Staff 1500+ attendees! 50 technical papers (30 live, 20 online) in three separate tracks! Standing room only...
Efinix Titanium FPGAs depend on mPower power integrity analysis

Efinix Titanium FPGAs depend on mPower power integrity analysis

By John Wagnon Efinix’s high-performance Titanium FPGAs are custom-tailored for the computing demands of mainstream applications, targeting markets from intelligent...
Plug and Play ESD protection

Plug and Play ESD protection

By Mark Tawfik Electrostatic discharge (ESD) is the discharge of static electrical current when two objects come into contact. One...
AUA announces extension of collaboration with Siemens for advanced research and academic enhancement

AUA announces extension of collaboration with Siemens for advanced research and academic enhancement

Back in 2012, the American University of Armenia (AUA) initiated a collaborative relationship with electronic design automation (EDA) leader Mentor...
Google, AMD, and Siemens EDA walk into a cloud…

Google, AMD, and Siemens EDA walk into a cloud…

By Michael White At DAC this past July, I had the opportunity to sit down with Phil Steinke from AMD...
What’s an ESD design window, and why do I care?

What’s an ESD design window, and why do I care?

By Derong Yan As we move to advanced semiconductor process nodes, electrostatic discharge (ESD) issues have become more critical in...
Can you spot the difference?

Can you spot the difference?

By James Paris We’ve all played those “Spot the Difference” games where you look at two similar images and try...
Outta my way – electrons coming through!

Outta my way – electrons coming through!

By Joel Mercier and Karen Chow Ever been in a hurry to get to a meeting, but there were a...
Papers and posters and prizes…oh my! Siemens EDA at DAC59!

Papers and posters and prizes…oh my! Siemens EDA at DAC59!

By Shelly Stalnaker The Design Automation Conference of 2022 has come to an end. As the dust settles, and the...
Custom & digital layout designers…Use the Calibre RealTime Platform to close DRC fixes faster.

Custom & digital layout designers…Use the Calibre RealTime Platform to close DRC fixes faster.

By Srinivas Velivala Douglas Adams, who wrote The Hitchhiker’s Guide to the Galaxy, once said of deadlines, “I love deadlines....
LVS Zero to Hero in 3 Easy Steps

LVS Zero to Hero in 3 Easy Steps

By James Paris When it comes to system-on-chip (SoC) physical verification turnaround-time, layout vs. schematic (LVS) verification can make or...
Improve your layout load time without capital investment?

Improve your layout load time without capital investment?

By Roger Kang How many times has this happened to you—you waited for an hour to complete the loading of...
Direct write DEF is DEFinitely the way to go for DFM back-annotation

Direct write DEF is DEFinitely the way to go for DFM back-annotation

By Armen Asatryan, James Paris DFM back-annotation to P&R Back-annotation of DFM changes to P&R databases can be a pain....
Interactive symmetry checking for analog/custom ICs: Faster, easier, more accurate

Interactive symmetry checking for analog/custom ICs: Faster, easier, more accurate

By Sara Khalaf While the reliability and performance of multiple types of designs such as analog, MEMs, and image sensors...
Optimizing design implementation with Calibre LEF/DEF technology

Optimizing design implementation with Calibre LEF/DEF technology

By James Paris and Armen Asatryan Ever hear the saying “When all you have is a hammer, everything looks like...
Curves ahead for IC manufacturing

Curves ahead for IC manufacturing

By John Sturtevant It turns out that the ideal mask pattern to print such a circle is in fact a...
Building the bridge between GDS and OASIS

Building the bridge between GDS and OASIS

By Shelly Stalnaker Switching from GDS to OASIS format can bring a host of benefits, but only if you make...
Does your parasitic extraction work in 5G IC designs?

Does your parasitic extraction work in 5G IC designs?

By Salma Ahmed and Karen Chow The next-generation 5G mobile communication network is a heterogeneous network providing significant performance advantages...
A touchy subject: RF IC layout verification

A touchy subject: RF IC layout verification

By Neel Natekar Radio frequency (RF) circuitry is an essential component of many of the critical applications we now rely...
The mPower toolsuite wins Elektronik Product of the Year for Software Tools!!

The mPower toolsuite wins Elektronik Product of the Year for Software Tools!!

By Shelly Stalnaker Every year, the editors of Elektronik in Germany compile a list of the most interesting and innovative...
Smoothing the path to manufacturing success begins with CMP simulation and fill optimization

Smoothing the path to manufacturing success begins with CMP simulation and fill optimization

By Ruben Ghulghazaryan, Davit Piliposyan, Zhengfang Liu, Chunshan Du, Jeff Wilson, Qijian Wan, Xinyi Hu, Zhixi Chen Chemical-mechanical polishing (CMP)...
How to get to Win-Win-Win in conflict management

How to get to Win-Win-Win in conflict management

By Shelly Stalnaker & Calibre Design staff Anyone who’s been through conflict management training understands the three basic scenarios. There’s...
Innovations in physical verification tools and technologies keep the IC industry moving forward

Innovations in physical verification tools and technologies keep the IC industry moving forward

By John Ferguson A few years ago, I was invited to present a paper discussing the advances in physical verification...
Using machine learning to improve DFM: a case study

Using machine learning to improve DFM: a case study

By Ruben Ghulghazaryan, Davit Piliposyan, Misak Shoyan Several years ago, the American University of Armenia (AUA) and Siemens EDA began...
The path of least resistance…leads to more reliable designs

The path of least resistance…leads to more reliable designs

By Derong Yan Meeting tapeout schedules and performance requirements are equally critical conditions for IC design success. Now engineers can...
Mastering RF design challenges: The role of capacitors and context-aware PEX Tools

Mastering RF design challenges: The role of capacitors and context-aware PEX Tools

By Claudia Relyea and Sandeep Koranne  Updated January 17, 2025 The increasing complexity of modern RF circuits demands precise modeling...
Accelerating IC design time to market with Calibre in the cloud

Accelerating IC design time to market with Calibre in the cloud

By Michael White When you’re flying, it’s fun to look out the window and see clouds from “the other side.”...
Ease on down the road…why “ease of use” is the next big thing in EDA, and how we get there

Ease on down the road…why “ease of use” is the next big thing in EDA, and how we get there

Ease of use is an important issue when enhancing product functionality and introducing new technology. Calibre Design Systems considers ease...
DRC voltage text annotations: Manually placed texts can be wrong!

DRC voltage text annotations: Manually placed texts can be wrong!

By Abdellah Bakhali System-on-chip (SoC) designs often use multiple intellectual property (IP) blocks from multiple IP providers. Each IP provider...
Do you trust the reliability of your 2.5D/3D IC package designs?

Do you trust the reliability of your 2.5D/3D IC package designs?

By Dina Medhat 2.5D/3D ICs have become an innovative solution for many design and integration challenges. Basic physical verification for...
Reliability checking for memory circuit design doesn’t have to destroy your eyesight!

Reliability checking for memory circuit design doesn’t have to destroy your eyesight!

By Hossam Sarhan Memory blocks contain sensitive analog circuits that are crucial for the proper functionality of the whole design....
DAC in December?? A Review of Calibre Design Solutions at DAC 2021

DAC in December?? A Review of Calibre Design Solutions at DAC 2021

Did it feel a bit weird to be submitting research papers for DAC 2022 while packing to go to DAC...
Is there a quick and easy way to calculate P2P resistance or current density between any two coordinates in my IC design layout?

Is there a quick and easy way to calculate P2P resistance or current density between any two coordinates in my IC design layout?

By Li Li Why, yes, there is! As you know, Calibre® PERC™ logic-driven layout (LDL) current density (CD) and point-to-point...
The “next” technology node: ready or not, here it comes

The “next” technology node: ready or not, here it comes

By Shelly Stalnaker For years, decades even, the semiconductor industry has lived by the process node, which was originally named...
Physical design engineers…Learn the secret to generating signoff fill in P&R and accelerating your tapeouts

Physical design engineers…Learn the secret to generating signoff fill in P&R and accelerating your tapeouts

By Srinivas Velivala Place and route (P&R) engineers are always on the lookout for ways to optimize their design flows...
IC package designers—looking for multi-die, system-level signoff verification?

IC package designers—looking for multi-die, system-level signoff verification?

By Shelly Stalnaker Ever tried a food sample when you were shopping…not just because it’s free food (!), but because...
Stronger together! Context-aware SPICE simulation combines the strengths of static and dynamic verification for faster, more precise full-chip ESD verification

Stronger together! Context-aware SPICE simulation combines the strengths of static and dynamic verification for faster, more precise full-chip ESD verification

By Neel Natekar Running dynamic simulations for full-chip ESD verification of ICs has become increasingly difficult (and in some cases,...
Package verification just took a big step forward…

Package verification just took a big step forward…

By Armen Asatryan and John Ferguson Over a decade ago, Calibre Design Solutions moved early into defining and building physical...
Coding for maximum performance and efficiency

Coding for maximum performance and efficiency

A great software program does much, much more than just execute routines. It also optimizes the use of CPU resources...
Calibre Design Solutions takes a look back at 2021

Calibre Design Solutions takes a look back at 2021

Okay, is everyone ready for an end-of-year wrapup? It’s certainly been an eventful 2021 for Calibre Design Solutions, even if...
The most interesting man in EDA…

The most interesting man in EDA…

As the calendar year comes to a close, we face the prospect of saying goodbye to someone who has been...
Calibre Design Solutions at Samsung SAFE Forum: technology leadership through innovation, intelligence, and integration

Calibre Design Solutions at Samsung SAFE Forum: technology leadership through innovation, intelligence, and integration

Since 2018, Samsung Foundry has operated their foundry ecosystem program, called SAFE™ (Samsung Advanced Foundry Ecosystem), to ensure deep collaboration...
mPower power integrity analysis solution certified by Tower Semiconductor for advanced analog process technologies

mPower power integrity analysis solution certified by Tower Semiconductor for advanced analog process technologies

The Siemens mPower power integrity solution, the first and only IC power integrity analysis solution that provides virtually unlimited scalability...
TSMC OIP Forum celebrates collaboration and innovation…and we have the awards to prove it!

TSMC OIP Forum celebrates collaboration and innovation…and we have the awards to prove it!

TSMC’s Open Innovation Platform® (OIP) brings together the creative thinking of customers and partners with the common goal of shortening...
Samsung Foundry and Siemens EDA: Helping companies design the next generation of Performance Platforms 2.0

Samsung Foundry and Siemens EDA: Helping companies design the next generation of Performance Platforms 2.0

Since 2018, the Samsung Advanced Foundry Ecosystem (SAFE™) program has encouraged and supported deep collaboration between Samsung Foundry and its...
Want to know what went on at the TSMC OIP Forum this year? Here’s the inside scoop…

Want to know what went on at the TSMC OIP Forum this year? Here’s the inside scoop…

TSMC customers and partners always look forward to the annual TSMC Open Innovation Platform® (OIP) Forums. Here, they get the...
Fix first, finish faster!

Fix first, finish faster!

By James Paris A few years ago, I came across some plans to build a simple bookshelf that would fit...
In the EDA world, efficiency + ease of use = productivity (and profitability!)

In the EDA world, efficiency + ease of use = productivity (and profitability!)

By Shelly Stalnaker Electronic design automation (EDA) grew out of the need to make it easier and faster to design...
Cloud Computing Makes Overnight TAT Attainable

Cloud Computing Makes Overnight TAT Attainable

By Matthew Hogan and Derong Yan As we all know, during the final sign-off verifications of full chip system-on-chip (SoC)...
Companies talk about how mPower enables their tape-out success

Companies talk about how mPower enables their tape-out success

By Joe Davis Earlier this week, we introduced our new mPower product line for power integrity signoff analysis.  Our innovative...
We know…power integrity analysis can be a really big pain, especially for really big designs

We know…power integrity analysis can be a really big pain, especially for really big designs

By Joe Davis Design teams use power integrity analysis to determine if the circuits in their designs will provide the...
Don’t like standing in lines? Get with the (right) programs!

Don’t like standing in lines? Get with the (right) programs!

By John Ferguson For a while, it appeared that the worst of the COVID pandemic was behind us. My mind...
Get rid of GUI frustration and speed up your Calibre verification job submissions!

Get rid of GUI frustration and speed up your Calibre verification job submissions!

By Slava Zhuchenya Graphical user interface (GUI) frustration is real. Deployment of integrated circuit (IC) physical and circuit verification decks...
Seeing is believing (and learning)…

Seeing is believing (and learning)…

Are you a visual learner? Lots of folks are—they understand and retain instructions much more easily when they can watch...
Caution! Avoid detours when improving resistance on ESD paths

Caution! Avoid detours when improving resistance on ESD paths

By Derong Yan As overall transistor dimensions shrink, integrated circuit (IC) chip designs become more sensitive to the damage caused...
Custom layout designers…Want to know a secret? You can close DRC faster. A lot faster…

Custom layout designers…Want to know a secret? You can close DRC faster. A lot faster…

By Srinivas Velivala Design rule checking (DRC) closure is a “tax” that custom layout designers must pay at all process...
Can we just agree that perception is everything? Especially in IC design?

Can we just agree that perception is everything? Especially in IC design?

By Dennis Joseph Is the dress black and blue, or white and gold? Is that a rabbit or a duck?...
2.5/3D IC designers! Don’t get hung up on latch-up!

2.5/3D IC designers! Don’t get hung up on latch-up!

By Dina Medhat Latch-up is modeled as a short circuit (low-impedance path) that occurs in an integrated circuit (IC). It...
Don’t hit a roadblock in automotive electronics reliability verification!

Don’t hit a roadblock in automotive electronics reliability verification!

The recent surge in used car prices may have you wondering what is driving this upswing, and just how much...
Efficient package delivery is not just for FedEx!

Efficient package delivery is not just for FedEx!

By John Ferguson Cost, risk, and the limitations of monolithic scaling are driving growth in multi-die (heterogeneous) advanced IC packaging...
Do you need an automated ESD verification methodology for 2.5D/3D ICs? If so, read on…

Do you need an automated ESD verification methodology for 2.5D/3D ICs? If so, read on…

By Dina Medhat Electrostatic discharge (ESD) events cause severe damage to unprotected integrated circuits (ICs). You already know that, of...
P&R engineers! Interested in saving (LOTS of) time in your tapeout schedules?

P&R engineers! Interested in saving (LOTS of) time in your tapeout schedules?

By Srinivas Velivala As a P&R engineer, you probably spend lots of time 1) waiting for batch DRC runs to...
Time is money…so why waste it on bad data?

Time is money…so why waste it on bad data?

By James Paris Last Saturday was my son’s birthday and we had many things to do to get ready for...
Shining a light on silicon photonics verification

Shining a light on silicon photonics verification

By John Ferguson, Omar ElSewefy, Nermeen Hossam, Basma Serry We’re all fascinated by light. Light beams shooting from aliens’ eyes,...
ESD protection verification in 2.5/3D ICs is HARD (or is it?) Our on-demand webinar has the answer

ESD protection verification in 2.5/3D ICs is HARD (or is it?) Our on-demand webinar has the answer

By Calibre Staff Electrostatic discharge (ESD) is a big worry for integrated circuit (IC) designers, for good reason. A bit...
SAFE is good. SAFE awards are even better…

SAFE is good. SAFE awards are even better…

By Calibre staff Safe is good, right? We all want to be safe, especially these days. But safe took on...
Turn IC verification challenge from a hard slog into a walk in the park by using static checks

Turn IC verification challenge from a hard slog into a walk in the park by using static checks

By Neel Natekar As integrated circuits (ICs) grow in complexity, they create new challenges for IC verification flows and electronic...
A SAMPle of what you need to know about SAMP technology

A SAMPle of what you need to know about SAMP technology

By Calibre Design Staff Prior to the availability of extreme ultraviolet (EUV) lithography, multi-patterning provided the only workable yield solution...
Realize Live + U2U: Side by Side

Realize Live + U2U: Side by Side

What a difference a year can make! Oh, we’re not referring to that virus that shifted the Earth on its...
Give me my space! Why high voltage and multiple power domain designs need automated context-aware spacing checks

Give me my space! Why high voltage and multiple power domain designs need automated context-aware spacing checks

By Sherif Hany and Abdellah Bakhali Regardless of which technology node they’re using, design houses that create high-voltage and multiple...
DFM: Still a really good thing to do!

DFM: Still a really good thing to do!

By Simon Favre If you’re not using critical area analysis and design for manufacturing to improve your IC yield and...
Collaboration and innovation thrive on diversity

Collaboration and innovation thrive on diversity

Back in November 2019, just a few short months before we all began an enforced year of isolation and separation,...
What is critical area analysis and why should I care?

What is critical area analysis and why should I care?

By Simon Favre What makes money in the semiconductor industry? A killer IC design? Something so innovative that it blows...
Adaptive Patterning: Moving with the times (and technologies)

Adaptive Patterning: Moving with the times (and technologies)

By John Ferguson and Kevin Rinebold Deca Technologies’ Adaptive Patterning technology and their newly-announced adaptive patterning design kit (APDK) have...
Building a strong reliability foundation with Calibre PERC

Building a strong reliability foundation with Calibre PERC

By Matthew Hogan How are you handling your reliability verification right now? Custom reliability verification? No reliability verification? How confident...
SPIE-ing at a distance…

SPIE-ing at a distance…

The SPIE Advanced Lithography Digital Forum took place Feb 22-26, and of course, Siemens EDA was there! We wouldn’t miss...
Early circuit verification can get you to tapeout faster…here’s how

Early circuit verification can get you to tapeout faster…here’s how

For the last few years, it’s been hard to see design teams struggling to meet tapeout schedules caused by increasing...
Automated ESD protection verification for 2.5-3D ICs is now a reality

Automated ESD protection verification for 2.5-3D ICs is now a reality

Got the mid-winter blahs? The post-New Year letdown? Looking for something to rev you up? How about an automated method...
Stochasticity of the input current is an important factor in accurate EM assessment for on-chip power delivery networks

Stochasticity of the input current is an important factor in accurate EM assessment for on-chip power delivery networks

At every conference, there is always that anticipatory moment just before the coveted “Best Paper” awards are announced. After all,...
2021: Time to simplify your life (or at least your workload)?

2021: Time to simplify your life (or at least your workload)?

Everyone makes resolutions for a better life at the start of a new year – why not resolve to make...
GLOBALFOUNDRIES and Mentor Launch a New Innovative DRC+ Hotspot Solution using Machine Learning in Calibre

GLOBALFOUNDRIES and Mentor Launch a New Innovative DRC+ Hotspot Solution using Machine Learning in Calibre

By Shelly Stalnaker – Mentor, A Siemens Business I recently had the chance to attend an on-demand webinar introducing the...
Mentor receives 2020 TSMC OIP Partner of the Year awards for EDA solutions

Mentor receives 2020 TSMC OIP Partner of the Year awards for EDA solutions

By Shelly Stalnaker – Mentor, A Siemens Business While the structure of the TSMC OIP Ecosystem Forum had to change...
Verification run configurations stressing you out? Automate them!

Verification run configurations stressing you out? Automate them!

By Srinivas Velivala – Mentor, A Siemens Business As all new IC verification engineers learn very quickly, there is far...
SAFE at home! Attending the Samsung SAFE forum in 2020

SAFE at home! Attending the Samsung SAFE forum in 2020

By Shelly Stalnaker – Mentor, A Siemens Business Samsung is going virtual with their 2020 SAFE forum, and Mentor, a...
Do you have a reliable automated waiver process for reliability verification?

Do you have a reliable automated waiver process for reliability verification?

By Dina Medhat – Mentor, A Siemens Business Design rule waivers Maybe a design rule that made sense at 22nm...
SAMP series finishes with SAMP cut mask decomposition techniques

SAMP series finishes with SAMP cut mask decomposition techniques

By David Abercrombie and Rehab Kotb Ali – Mentor, A Siemens Business We’ve been writing about self-aligned multi-patterning (SAMP) topics...
Breaking it down…How interconnect segmentation helps resolve P2P resistance errors

Breaking it down…How interconnect segmentation helps resolve P2P resistance errors

By Slava Zhuchenya – Mentor, A Siemens Business Point-to-point (P2P) simulations find and report nets that exceed predefined resistance thresholds...
VLSI optimization—a bridge too far?

VLSI optimization—a bridge too far?

source: Andrew Shiva/CC BY-SA 4.0By Sherif Hany – Mentor, A Siemens Business Job without end. How about job done? Have...
A better, faster, smarter way to insert filler cells in P&R

A better, faster, smarter way to insert filler cells in P&R

By Fady Fouad, Jeff Wilson, Esraa Swillam – Mentor, A Siemens Business Filler cells—Those cells inserted by the P&R tool...
Early-stage design verification slowing down your schedules? Watch our on-demand web seminar for the solution

Early-stage design verification slowing down your schedules? Watch our on-demand web seminar for the solution

You’re integrating your design. Some blocks are incomplete. Others just have placeholders. But you can’t wait until every component is...
Can you picture your EDA in the cloud?

Can you picture your EDA in the cloud?

Moving electronic design automation (EDA) design verification to the cloud—we’ve talked about it and written about it, but sometimes you...
Five white papers that could change your life…

Five white papers that could change your life…

By Shelly Stalnaker – Mentor, A Siemens Business Someone once said to me, “You don’t have to be smart to...
The benefits of working together: AUA and Mentor celebrate their long-term collaboration

The benefits of working together: AUA and Mentor celebrate their long-term collaboration

By Sedrak Sargisian – Mentor, A Siemens Business We recently had the privilege of hosting representatives from the American University...
Fixing DFM hotspots with Calibre signoff during design implementation

Fixing DFM hotspots with Calibre signoff during design implementation

By Srinivas Velivala – Mentor, A Siemens Business Adding the Calibre RealTime Digital API to the GLOBALFOUNDRIES DFM-POP hotspot fixing...
EDA in the cloud—your questions answered

EDA in the cloud—your questions answered

By Michael White – Mentor, A Siemens Business EDA in the cloud…learn why the cloud has become a viable and...
Automated common resistance checking…it’s the smart thing to do!

Automated common resistance checking…it’s the smart thing to do!

By Hossam Sarhan – Mentor, A Siemens Business Work smarter, not harder. Isn’t that what everyone is always telling you?...
Automate via insertion for improved design reliability and performance

Automate via insertion for improved design reliability and performance

By Fady Fouad, Esraa Swillam, and Jeff Wilson – Mentor, A Siemens Business IR drop and EM issues slowing down...
Mentor, AMD, and Microsoft collaborate on EDA in the cloud

Mentor, AMD, and Microsoft collaborate on EDA in the cloud

By Omar El-Sewefy – Mentor, A Siemens Business While cloud processing has been around for years, running integrated circuit (IC)...
Track decomposition for SAMP processes—What you need to know

Track decomposition for SAMP processes—What you need to know

By David Abercrombie and Rehab Kotb-Ali – Mentor, A Siemens Business Understanding key requirements and root causes of errors is...