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TSMC OIP Forum celebrates collaboration and innovation…and we have the awards to prove it!

By Design With Calibre

TSMC’s Open Innovation Platform® (OIP) brings together the creative thinking of customers and partners with the common goal of shortening design time, time-to-volume, time-to-market, and ultimately, time-to-revenue. Every year, that collaborative process is on display at the TSMC OIP Ecosystem Forum, as TSMC and its many partners and customers come together to present and celebrate their successes.

One exciting part of the event is always the announcement of the TSMC OIP Partner of the Year awards for those companies who, in cooperation with TSMC, achieved outstanding performance in design, development, and technology innovation. The recognition is highly sought-after, and we’re proud to say that Siemens EDA, as a part of Siemens Digital Industries Software, received three Partner of the Year awards in 2021:

EDA Alliance Awards

  • Joint Development of 4nm Design Infrastructure, for the optimization of our Calibre® nmPlatform software and Analog FastSPICE Platform
  • Joint Development of 3DFabricTM Design Solution, for collaboration on our Xpedition™ Substrate Integrator, Xpedition Package Designer, HYPERLYNX™, Calibre 3DStack/nmDRC/nmLVS/xACT and Tessent™ solutions

Cloud Alliance

  • Joint Development of Cloud-Based Productivity Solution, for our Calibre nmDRC solution

These awards add to the full complement of TSMC partner awards we have received over the years. Pictured here with this year’s awards, as well as some of the many other TSMC Partner awards given to Siemens EDA over the years, is Juan Rey, vice president of Calibre engineering. His leadership of the Calibre engineering team is a significant reason that the Calibre team has been the recipient of so many TSMC awards!

Of course, as pleased as we are by the recognition at this year’s TSMIC OIP Forum, we are already hard at work on new technology and software to continue delivering industry-leading EDA tools and solutions to the semiconductor community. Siemens EDA recognizes that today’s challenges are tomorrow’s solutions, and we are committed to ensuring that promise of tomorrow for our customers.

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/calibre/2021/11/29/tsmc-oip-forum-celebrates-collaboration-and-innovationand-we-have-the-awards-to-prove-it/