Navigating ESD challenges in 2.5D/3D ICs: A guide to robust automated verification

By Dina Medhat Electrostatic discharge (ESD) events cause severe damage to unprotected integrated circuits (ICs). ESD events cause severe damage…

Siemens Calibre 3DThermal wins 2024 WEAA award for innovation in 3D IC thermal analysis

Siemens Digital Industries Software’s Calibre® 3DThermal tool was awarded the 2024 AspenCore World Electronics Achievement Award (WEAA) in the EDA/IP/Software…

Dr. Fedor Pikus cultivates engineering talent in Armenia

The semiconductor market depends on the work of talented engineers, but the supply of qualified engineers worldwide hasn’t kept pace…

Shift left in IC design: A holistic strategy for faster, smarter verification

By Michael White and David Abercrombie As IC design complexity continues to grow, companies are turning to the shift left…

Tom Quan is now officially retired from TSMC

For those of us in Semiconductor Ecosystem, watching the TSMC OIP (Open Innovation Platform) evolve from a fledgling foundry event…

Unveiling the future of 3DIC design with Calibre 3DThermal

By Lee Wang The semiconductor industry is undergoing a transformative shift from traditional 2D integrated circuit (IC) designs to more…

Cloud Flight Plans enable cost-effective use of the cloud for peak productivity

By Chris Clee You might ask, “What on Earth is a Cloud Flight Plan?” It’s a collection of best practices…

Shift left for more efficient block design and chip integration

Block/chip integration is a lot more complicated than it gets credit for. On the face of it, chip integration just…

Using a shift left strategy to address block/chip design challenges during design-stage verification

By David Abercrombie For IC designers, striking the right balance between tight deadlines and limited resources is a constant challenge….