Semiconductor Packaging

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Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met. Our integrated flow addresses prototyping challenges to signoff for FOWLP, 2.5/3D IC, and other emerging integration technologies.

Learn more about semiconductor packaging design and verification.

Featured posts

Illustration of 3D IC stacked design

3D IC technology: your comprehensive guide to enabling heterogeneous integration

May 19, 2025

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

By John McMillan
14 MIN READ
Screen shots of Innovator3D IC software in use.

Exploring TSMC InFO_oS and InFO_PoP certification

February 28, 2025

Siemens EDA has recently achieved this certification for Xpedition Package Designer as part of the TSMC InFO_oS and InFO_PoP workflows.

By Keith Felton
2 MIN READ
Text that says what's new in IC Packaging 2409 next to a stylized X

What’s new in IC Packaging 2409

September 19, 2024

The 2409 release is a landmark update in the field of electronic design automation (EDA), introducing a next-generation solution for…

By Keith Felton
3 MIN READ

Latest posts

what's new Innovator3D IC 2510

What’s New in Innovator3D IC solution suite release 2510

October 27, 2025

Innovator3D IC solution suite release 2510 marks a groundbreaking first release of the comprehensive Innovator3D IC solution suite.

By Keith Felton
3 MIN READ

From 2.5D to true 3D IC: What’s driving the next wave of integration.​

October 8, 2025

With 3D IC integration blurring the lines between chip and package, is your team’s mindset truly system-centric, or are traditional…

By John McMillan
13 MIN READ
10 steps for successful heterogeneous chiplet integration

Unlock advanced chiplet design success: Discover the Siemens EDA Heterogeneous Integration eBook series

September 25, 2025

The future of semiconductor innovation is rapidly shifting from monolithic chips to advanced, multi-chiplet architectures. As devices demand greater power,…

By Tova Levy
4 MIN READ

Why every 3D IC needs a test vehicle before it hits production​

September 22, 2025

Would you risk millions of dollars on a semiconductor design without knowing if it can be manufactured? Discover why test…

By John McMillan
13 MIN READ

Breaking down 50 million pins: A smarter way to design 3D IC packages​

September 3, 2025

As 3D IC complexity skyrockets, are we truly evolving our design methodologies at the same pace, or are we unknowingly…

By John McMillan
8 MIN READ

Navigating signal integrity and power integrity (SI/PI) in 3D IC design​

August 19, 2025

Q: Is dedicated SI/PI analysis still necessary in 3D IC design? A: With the rapid advancements in chip design automation…

By John McMillan
11 MIN READ
Illustrative example of 3D IC heat dissipation - thermal management

IC package thermal resistance: Accurate modeling for system-level IC thermal reliability

August 19, 2025

As semiconductor devices grow more powerful and complex, effective thermal management has become a top priority in IC design. With…

By John McMillan
6 MIN READ
3D IC Stackup in Innovator3D IC

The Missing Piece for Chiplet Success

August 11, 2025

Chiplets are revolutionizing the semiconductor industry, enabling unprecedented levels of integration, performance, and flexibility. By breaking complex designs into smaller,…

By Tova Levy
2 MIN READ

How to Design Smarter: System-level multiphysics in 3D integration​

August 7, 2025

What happens when a perfectly functioning chip fails to perform in a 3D IC package? As semiconductor designs stack multiple…

By John McMillan
12 MIN READ