Semiconductor Packaging

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Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met. Our integrated flow addresses prototyping challenges to signoff for FOWLP, 2.5/3D IC, and other emerging integration technologies.

Learn more about semiconductor packaging design and verification.

Featured posts

Screen shots of Innovator3D IC software in use.

Exploring TSMC InFO_oS and InFO_PoP certification

February 28, 2025

Siemens EDA has recently achieved this certification for Xpedition Package Designer as part of the TSMC InFO_oS and InFO_PoP workflows.

By Keith Felton
2 MIN READ

3D IC design solutions: 2024 – Year in review

December 16, 2024

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

By John McMillan
3 MIN READ
Text that says what's new in IC Packaging 2409 next to a stylized X

What’s new in IC Packaging 2409

September 19, 2024

The 2409 release is a landmark update in the field of electronic design automation (EDA), introducing a next-generation solution for…

By Keith Felton
3 MIN READ

Latest posts

Siemens Innovator 3D IC wins 3D InCites award for 2025

Siemens Innovator3D IC wins 2025 3D InCites Technology Enablement award

April 2, 2025

In the fast-evolving landscape of semiconductor technology, innovation and collaboration are key drivers of progress. As advanced interconnect and packaging…

By Tova Levy
2 MIN READ
Heterogeneous integration eBook IC Packaging

How can IC and package designers navigate the complexities of heterogeneous integration?

March 19, 2025

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining…

By Tova Levy
2 MIN READ

Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

March 7, 2025

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and…

By John McMillan
3 MIN READ
Screen shots of Innovator3D IC software in use.

Exploring TSMC InFO_oS and InFO_PoP certification

February 28, 2025

Siemens EDA has recently achieved this certification for Xpedition Package Designer as part of the TSMC InFO_oS and InFO_PoP workflows.

By Keith Felton
2 MIN READ

3D IC design solutions: 2024 – Year in review

December 16, 2024

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

By John McMillan
3 MIN READ

User2User 2024: Pioneering semiconductor reliability automotive apps – imec’s Canary chip

November 5, 2024

In this User2User 2024 presentation, Dr. Thomas Kallstenius, representing imec, the world’s leading independent research institute specializing in nanoelectronics, whose Belgium-based…

By John McMillan
4 MIN READ

EE Times Fireside chat: Linking design to manufacturing for a sustainable semiconductor future

October 21, 2024

Listen in as Michael Munsey, VP at Siemens EDA, joins EE Times’ Sally Ward-Foxton for a Fireside chat Q&A session…

By John McMillan
2 MIN READ

User2User 2024: Customer-specific solutions with Siemens EDA tools: Sysberry GmbH

October 15, 2024

The presentation features consulting project examples from Sysberry GmbH that leverage Siemens EDA tools and APIs.

By John McMillan
3 MIN READ

Taking 3DIC heterogeneous integration mainstream

October 2, 2024

In this presentation, we will explore the challenges introduced by 3DIC, the current state of the industry to address those challenges, the ecosystem needed to support 3DIC, and how users today can successfully adopt 3DIC leveraging new solutions, workflows, and 3DIC Design Kits (3DK) from Siemens EDA that are designed specifically with 3DIC in mind.

By John McMillan
3 MIN READ