Semiconductor Packaging

Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met. Our integrated flow addresses prototyping challenges to signoff for FOWLP, 2.5/3D IC, and other emerging integration technologies.

Learn more about semiconductor packaging design and verification.

Latest posts

Advanced thermal design strategies for 3D IC systems

February 27, 2026

Not long ago, OpenAI CEO Sam Altman remarked that advanced AI video generation workloads were pushing GPUs toward their thermal limits….

By Emily Yan

6 MIN READ

Screen shot of the Innovator3D IC canvas

The smart path to STCO with Hierarchical Device Planning (HDP)

February 20, 2026

Siemens partnered with Intel Foundry to develop a STCO centric capability that enables a “smart path” to homogeneous disaggregation using Hierarchical Device Planning and parameterized pin regions.

By Keith Felton

2 MIN READ

Five Key Trends of Co-Packaged Optics (CPO) in 2026

February 5, 2026

For years, data-center performance scaled by following a familiar playbook: faster GPUs, higher SerDes rates, and increasingly aggressive board designs….

By Tony Mastroianni

5 MIN READ

Six Key Trends Redefining 3D IC Packaging in the AI Era

February 5, 2026

Some say we are officially in the Post-Moore’s Law world.  Moore himself closed his seminal paper by mentioning the “day…

By Pratyush Kamal

5 MIN READ

Verifying your 2.5/3D IC device assembly level netlist

February 4, 2026

In this blog we will introduce a new way to verify your 2.5/3D IC device assembly level netlist using formal verification that can exhaustively verify all interconnections between the chiplet blocks.

By Keith Felton

3 MIN READ

Thermal management in 3D IC: Challenges, modeling and design strategies

January 26, 2026

You are likely here because thermal issues have become the primary constraint shaping your 3D IC design decisions. As 3D integration pushes more performance into smaller footprints, thermal…

By Tova Levy

5 MIN READ