Semiconductor Packaging - Siemens Software

Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met. Our integrated flow addresses prototyping challenges to signoff for FOWLP, 2.5/3D IC, and other emerging integration technologies.

Learn more about semiconductor packaging design and verification.

Featured posts

Streamlining 3D IC design: A complete eBook series for building smarter, faster, and more predictable 3D IC workflows

July 21, 2026

Explore the full Streamlining 3D IC design eBook series and discover how Siemens methodologies and tools can help your team accelerate innovation, improve design quality, and manage the complexity of advanced 2.5D and 3D IC development.

By Keith Felton

5 MIN READ

3D IC technology: your comprehensive guide to enabling heterogeneous integration

May 19, 2025

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

By John McMillan

14 MIN READ

Screen shots of Innovator3D IC software in use.

Exploring TSMC InFO_oS and InFO_PoP certification

February 28, 2025

Siemens EDA has recently achieved this certification for Xpedition Package Designer as part of the TSMC InFO_oS and InFO_PoP workflows.

By Keith Felton

2 MIN READ

Latest posts

Beyond the limits of silicon: Why 3D IC is the next frontier of innovation

September 17, 2026

Guest author: Bob Patti, President of NHanced Semiconductors For decades, the semiconductor industry followed a predictable rhythm: shrink the transistors,…

By Tova Levy

2 MIN READ

What's new in Innovator3D IC Integrator 2604.0004

Streamlining 3D IC design with Innovator3D IC product family release 2604.0004

September 2, 2026

Release 2604.0004 (available now on Support Center) brings a number of design capabilities and productivity enhancements further enhancing Innovator3D IC…

By Keith Felton

2 MIN READ

Two systems, one goal: understanding PLM vs. IPLM in 3D IC design

September 1, 2026

Guest author: Vishal Moondhra, VP of Solutions Engineering for Perforce IPLM Your team just made a critical design change to…

By Tova Levy

5 MIN READ

Streamlining 3D IC design: A complete eBook series for building smarter, faster, and more predictable 3D IC workflows

July 21, 2026

By Keith Felton

5 MIN READ

Innovator3D IC Integrator 2604.002: Faster pathfinding for advanced 3D IC and chiplet design

July 8, 2026

As advanced packaging and chiplet-based architectures continue to push design complexity higher, engineering teams need tools that move just as…

By Keith Felton

< 1 MIN READ

An image of a 3D IC from Innovator3D IC protocol analyzer software

Streamlining 3D IC design interface performance

May 26, 2026

If you are planning to design a high-performance multi-chiplet heterogeneously integrated package, then you know that to achieve design performance, the integration between the logic chiplets is key.

By Keith Felton

< 1 MIN READ

Streamlining power integrity analysis for 3D IC designs

May 11, 2026

The rules of semiconductor scaling have changed. With traditional transistor scaling slowing, advanced packaging has emerged as the primary driver…

By Sudarshan Deo and Muhammad Hassan

5 MIN READ

Streamlining AI device design using AI and Innovator3D IC Integrator

April 27, 2026

Two such STCO-related activities are now AI-powered in Innovator3D IC Integrator as part of the 2604 release and deliver superior results in an efficient predictable manner.

By Keith Felton

2 MIN READ

What’s new in Innovator3D IC 2604

April 27, 2026

This latest Innovator3D IC release brings a raft of design capability and productivity enhancements to the product family, further enabling its ability to design for the latest AI and Hyperscaler devices using advanced heterogeneous integration platforms.

By Keith Felton

2 MIN READ