Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met. Our integrated flow addresses prototyping challenges to signoff for FOWLP, 2.5/3D IC, and other emerging integration technologies.
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Taking 2.5D/3D IC physical verification to the next level
Taking 2.5D/3D IC physical verification to the next level. As package designs continue to evolve, so must the verification requirements. Designers working on even the most complex multi-die, multi-chiplet stacked configurations require enhanced checking capabilities to quickly and easily verify that the physical die are placed correctly to ensure proper connectivity and electrical behavior.