Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met. Our integrated flow addresses prototyping challenges to signoff for FOWLP, 2.5/3D IC, and other emerging integration technologies.

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Image of a chip on a board with text that says Navigating complexities in power delivery analysis: embracing the shift-left approach

Navigating complexities in power delivery analysis: embracing the shift-left approach

The demand for increased power and performance in semiconductor packages has surged. As more die and chiplets are integrated into…

Parasitic extraction technologies: Advanced node and 3D-IC design

Advanced nodes and 3D-IC packages require new and enhanced parasitic extraction processes that can resolve a variety of complex parasitic issues in these designs.

Impacts of 3D IC on the future

3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic…

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.

Crossing the chasm: Bringing SoC and package verification together

3D IC package designers need assembly-level LVS for HDAP verification.

Package designers need assembly-level LVS for HDAP verification

While advanced integrated circuit (IC) packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique…

An image of an IC package design in Xpedition Package Designer with text that says: Achieving substrate supplier fabrication requirements: a designer's guide

Achieving substrate supplier fabrication requirements: a designer’s guide

Designing advanced package layouts with large areas of metal can be a daunting task, given the stringent requirements imposed by…

Understanding 3D IC Technology: Unveiling the Future of Integrated Circuits

Delve into the world of 3D IC technology, its architecture, benefits, and applications. Learn how it’s reshaping the future of integrated circuits for enhanced performance and efficiency.

Image of chiplets with text onscreen saying HBM

High Bandwidth Memory (HBM): Unleashing the power of next-gen memory technology

In the ever-evolving realm of semiconductor technology, one innovation stands out above the rest: High Bandwidth Memory (HBM). Offering unparalleled…