To help design teams stay ahead of the curve, Siemens has released the comprehensive 2504 update for its Innovator3D IC (i3D) and Xpedition Package Designer (xPD) solutions.
The 2409 release is a landmark update in the field of electronic design automation (EDA), introducing a next-generation solution for…
The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package…
The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…
