Product Updates - Semiconductor Packaging

Streamlining AI device design using AI and Innovator3D IC Integrator

April 27, 2026

Two such STCO-related activities are now AI-powered in Innovator3D IC Integrator as part of the 2604 release and deliver superior results in an efficient predictable manner.

By Keith Felton

2 MIN READ

What’s new in Innovator3D IC 2604

April 27, 2026

This latest Innovator3D IC release brings a raft of design capability and productivity enhancements to the product family, further enabling its ability to design for the latest AI and Hyperscaler devices using advanced heterogeneous integration platforms.

By Keith Felton

2 MIN READ

What’s New in Innovator3D IC solution suite release 2510

October 27, 2025

Innovator3D IC solution suite release 2510 marks a groundbreaking first release of the comprehensive Innovator3D IC solution suite.

By Keith Felton

3 MIN READ

Siemens Xcelerator X with a 3D PCB inside

What’s new in IC Packaging 2504

April 24, 2025

To help design teams stay ahead of the curve, Siemens has released the comprehensive 2504 update for its Innovator3D IC (i3D) and Xpedition Package Designer (xPD) solutions.

By Keith Felton

4 MIN READ

What’s new in IC Packaging 2409

September 19, 2024

The 2409 release is a landmark update in the field of electronic design automation (EDA), introducing a next-generation solution for…

By Keith Felton

3 MIN READ

What’s new in Xpedition IC Packaging VX.2.14

September 19, 2023

The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package…

By Keith Felton

2 MIN READ

What’s new in Xpedition Advanced IC Packaging release VX.2.12

September 19, 2022

The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…

By Keith Felton

3 MIN READ