Test engineer performing design rule checks manually for 3D IC heterogenous designs

Assembly level layout vs. schematic in 3D IC design verification

In our fifth podcast on 3D IC design workflows, we discussed what a 3D IC physical design workflow looks like,…

The five keys to next-generation IC packaging design: Part 3

Scalability and range of IC packaging design solutions In my last blog, I talked about multi-domain and cross-domain integration that…

Engineer seated at computer studying physical prototype for early planning of interconnect systems and design verification workflows

Importance of early planning for interconnect verification in 3D IC physical design workflows

In our last podcast on 3D IC architecture workflows, we discussed how a system or microarchitectures determine how to partition…

The five keys to next-generation IC packaging design: Part 2

Multi-domain integration enables faster time to market for complex advanced semiconductor packages with a seamless integration of design and verification.

3D IC design engineer using gloved hands to inspect and verify components

Front-end architectural verification considerations for 3D IC design

So far in our 3D IC blog series, we’ve discussed efforts to create chiplet ecosystems, design workflow changes needed to…

Megatrends of advanced IC packaging solutions 

Over last 2-3 years, everyone has been talking about Moore’s “Law” becoming invalid. Even if it does, we will continue…

Evolution of 3D IC Architecture and the impact to design flows

Evolution of 3D IC Architecture and the impact to design flows

In our last blog about 3D IC, we discussed the models chiplet vendors need to provide System-in-Package (SiP) integrators to…

3D IC and the system-technology co-optimization (STCO) approach

3D IC and the system-technology co-optimization (STCO) approach

Semiconductor engineers aim to deliver best-in-class devices despite technology scaling and cost limitations of monolithic integrated circuit (IC) design. To…

What’s the current state of 3D IC design?

In the first podcast about 3D IC heterogeneous integration, we talked about the disaggregation of once monolithic implementation architectures into…