SemiWiki Podcast – An expert panel discussion on the move to chiplets

Listen in as Tony Mastroianni Advanced Packaging Solutions Director – Siemens EDA along with Saif Alam Vice President of Engineering…

An image of a PCB with text that says IC Packaging 2.13

What’s new in Xpedition IC Packaging release VX.2.13

The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…

Illustration that says next generation IC Packaging part 4

The five keys to next-generation IC packaging design: Part 4

“Golden signoff” – The final step in the semiconductor packaging process In my last blog post, I talked about the…

The five keys to next-generation IC packaging design: Part 3

Scalability and range of IC packaging design solutions In my last blog, I talked about multi-domain and cross-domain integration that…

The five keys to next-generation IC packaging design: Part 2

Multi-domain integration enables faster time to market for complex advanced semiconductor packages with a seamless integration of design and verification.

Megatrends of advanced IC packaging solutions 

Over last 2-3 years, everyone has been talking about Moore’s “Law” becoming invalid. Even if it does, we will continue…

3D IC and the system-technology co-optimization (STCO) approach

3D IC and the system-technology co-optimization (STCO) approach

Semiconductor engineers aim to deliver best-in-class devices despite technology scaling and cost limitations of monolithic integrated circuit (IC) design. To…

Getting your metal fill right

If you’re involved in semiconductor package design using routable substrates — that is, as opposed to leadframe based — then…

Semiconductor package design market trends: 2023 forecast from Siemens EDA

Semiconductor package design industry in 2023 expects to see accelerated growth of heterogeneous integration resulting emergence and adoption of new technology.