News - Semiconductor Packaging

2.5D vs. 3D IC: which chip packaging technology is right for you?

June 24, 2025

Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional…

By John McMillan

6 MIN READ

3D IC rendering illustrating advanced chip packaging with vertically stacked dies

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

June 5, 2025

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip…

By John McMillan

6 MIN READ

3D IC technology: your comprehensive guide to enabling heterogeneous integration

May 19, 2025

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

By John McMillan

14 MIN READ

chiplet integration with STCO system technology co optimization

Resolving Design Fragmentation Challenges in Chiplet Integration with STCO

May 11, 2025

Are you struggling to integrate chiplets into an advanced packaging platform due to design fragmentation challenges? The complexity of managing…

By Tova Levy

< 1 MIN READ

Siemens Innovator 3D IC wins 3D InCites award for 2025

Siemens Innovator3D IC wins 2025 3D InCites Technology Enablement award

April 2, 2025

In the fast-evolving landscape of semiconductor technology, innovation and collaboration are key drivers of progress. As advanced interconnect and packaging…

By Tova Levy

2 MIN READ

Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

March 7, 2025

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and…

By John McMillan

3 MIN READ

Screen shots of Innovator3D IC software in use.

Exploring TSMC InFO_oS and InFO_PoP certification

February 28, 2025

Siemens EDA has recently achieved this certification for Xpedition Package Designer as part of the TSMC InFO_oS and InFO_PoP workflows.

By Keith Felton

2 MIN READ

3D IC design solutions: 2024 – Year in review

December 16, 2024

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

By John McMillan

3 MIN READ

User2User 2024: Pioneering semiconductor reliability automotive apps – imec’s Canary chip

November 5, 2024

In this User2User 2024 presentation, Dr. Thomas Kallstenius, representing imec, the world’s leading independent research institute specializing in nanoelectronics, whose Belgium-based…

By John McMillan

4 MIN READ