3d ic stacked chip

2.5D vs. 3D IC: which chip packaging technology is right for you?

Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional…

3D IC rendering illustrating advanced chip packaging with vertically stacked dies

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip…

Illustration of 3D IC stacked design

3D IC technology: your comprehensive guide to enabling heterogeneous integration

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

chiplet integration with STCO system technology co optimization

Resolving Design Fragmentation Challenges in Chiplet Integration with STCO

Are you struggling to integrate chiplets into an advanced packaging platform due to design fragmentation challenges? The complexity of managing…

Siemens Innovator 3D IC wins 3D InCites award for 2025

Siemens Innovator3D IC wins 2025 3D InCites Technology Enablement award

In the fast-evolving landscape of semiconductor technology, innovation and collaboration are key drivers of progress. As advanced interconnect and packaging…

Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and…

Screen shots of Innovator3D IC software in use.

Exploring TSMC InFO_oS and InFO_PoP certification

Siemens EDA has recently achieved this certification for Xpedition Package Designer as part of the TSMC InFO_oS and InFO_PoP workflows.

3D IC design solutions: 2024 – Year in review

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

User2User 2024: Pioneering semiconductor reliability automotive apps – imec’s Canary chip

In this User2User 2024 presentation, Dr. Thomas Kallstenius, representing imec, the world’s leading independent research institute specializing in nanoelectronics, whose Belgium-based…