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News

3D IC and the system-technology co-optimization (STCO) approach

3D IC and the system-technology co-optimization (STCO) approach

August 3, 2022

Semiconductor engineers aim to deliver best-in-class devices despite technology scaling and cost limitations of monolithic integrated circuit (IC) design. To…

By anthonymastroianni
2 MIN READ
As consumer electronic devices grow increasingly connected, intelligent and advanced, designers need new methodologies such as 3D IC to address more than Moore limitations.

What’s the current state of 3D IC design?

July 20, 2022

In the first podcast about 3D IC heterogeneous integration, we talked about the disaggregation of once monolithic implementation architectures into…

By Heather George
8 MIN READ

Getting your metal fill right

July 14, 2022

If you’re involved in semiconductor package design using routable substrates — that is, as opposed to leadframe based — then…

By Keith Felton
2 MIN READ
The beginner’s guide to 3D IC

The beginner’s guide to 3D IC

July 7, 2022

As consumer electronic devices grow increasingly connected, intelligent and advanced, designers need new methodologies such as 3D IC to address…

By Heather George
16 MIN READ

Semiconductor package design market trends: 2023 forecast from Siemens EDA

June 29, 2022

Semiconductor package design industry in 2023 expects to see accelerated growth of heterogeneous integration resulting emergence and adoption of new technology.

By Keith Felton
3 MIN READ