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3D-IC design using Calibre 3DSTACK

By Minjung Han (minjung.han@siemens.com), Calibre Support Application Engineer 3D-IC technology is gaining attention as an alternative to complement Moore’s Law,…

Calibre 3DSTACK을 활용한 3D-IC 설계

By 한민정 과장 (minjung.han@siemens.com), Calibre Support Application Engineer 3D-IC 기술은 무어의 법칙이 물리적 한계에 가까워지면서 이를 보완하는 대안으로 주목받고 있습니다….

Simulation debug capabilities of ATPG: A method to check the values simulated

ATPG’s goal is to create a set of patterns that achieves a given test coverage, where test coverage is the…

기능 검증에서 AI/ML의 적용

인공지능(AI)과 머신러닝(ML)은 전자 설계 자동화(EDA)를 포함하여 전 세계 산업을 변화시키고 있습니다. 기능검증(FV) 분야에서 이러한 기술들은 효율성, 정확성 및 자동화를 향상시키는…

Applications of AI/ML in Functional Verification

By Yunhong Min, Support Application Engineer, DVT Artificial Intelligence (AI) and Machine Learning (ML) are transforming industries worldwide, including Electronic…

Optimizing DFT efficiency: Essential guidelines for SSN Bus Width and EDT channels

For an SSN design, only the SSN bus data in, SSN bus data out, SSN bus clock, and the TAP…

Advantages Of Using Tessent Shell For LogicBist Built-in Self Test Implementation

Logic Built-In Self-Test (LogicBIST/LBIST) embeds test circuitry directly within a chip, making it an essential feature for modern integrated circuit…

Reduce Your Tessent MemoryBIST Simulation Debug Time

Modern technologies like AI, IoT and other smart systems need a large amount of data storage leading to an increase…

Introduction to Tessent Multi-Die

With the latest developments in the electronic industry, supporting revolutionary complex systems such as Autonomous vehicles or AI products/chips system-in-package…