In today’s semiconductor manufacturing, the pursuit of perfection leaves no room for error. Traditional testing methodologies often miss subtle yet…
Concurrent BISR (Built-In Self-Repair) chains refer to a methodology that enables the simultaneous processing of multiple BISR chains during power-up,…
The BISR controller is at the heart of the Tessent Platform repair solution. It facilitates access to the BISR chains…
A tap controller, or Test Access Port (TAP) controller, is a critical component in the design-for-test (DFT) methodology used in…
By Minjung Han (minjung.han@siemens.com), Calibre Support Application Engineer 3D-IC technology is gaining attention as an alternative to complement Moore’s Law,…
By 한민정 과장 (minjung.han@siemens.com), Calibre Support Application Engineer 3D-IC 기술은 무어의 법칙이 물리적 한계에 가까워지면서 이를 보완하는 대안으로 주목받고 있습니다….
ATPG’s goal is to create a set of patterns that achieves a given test coverage, where test coverage is the…
인공지능(AI)과 머신러닝(ML)은 전자 설계 자동화(EDA)를 포함하여 전 세계 산업을 변화시키고 있습니다. 기능검증(FV) 분야에서 이러한 기술들은 효율성, 정확성 및 자동화를 향상시키는…
By Yunhong Min, Support Application Engineer, DVT Artificial Intelligence (AI) and Machine Learning (ML) are transforming industries worldwide, including Electronic…
