Valor DFM Solutions
Strengthening PCB Solder Connections
To increasing the overall solder strength within a PCB design, designers should be focusing on two distinct but related factors: The material composition of the solder, and the pad and footprint layouts for individual components. The composition of the solder itself will depend upon the application of the board, the components, construction method and materials within the board, and the overall final board quality. The overall footprint of the component will be dependent upon the components within a BOM and the recommended assembly guidelines of your assemblers. Both of these factors rely on discussions and interactions with your assembly house and leaving these discussions until after the design has been released ultimately limits your assembly options.
Custom IC Verification
Bridging the gap between semiconductor IP providers and integrators
Note: To learn more about Solido Crosscheck’s QA exchange deck, check out the whitepaper https://resources.sw.siemens.com/en-US/white-paper-the-qa-exchange-deck-in-solido-crosscheck-enables-an-ip-qualification. This whitepaper discusses how the...