Thought Leadership - Semiconductor Packaging

Beyond the limits of silicon: Why 3D IC is the next frontier of innovation

September 17, 2026

Guest author: Bob Patti, President of NHanced Semiconductors For decades, the semiconductor industry followed a predictable rhythm: shrink the transistors,…

By Tova Levy

2 MIN READ

Two systems, one goal: understanding PLM vs. IPLM in 3D IC design

September 1, 2026

Guest author: Vishal Moondhra, VP of Solutions Engineering for Perforce IPLM Your team just made a critical design change to…

By Tova Levy

5 MIN READ

Five Key Trends of Co-Packaged Optics (CPO) in 2026

February 5, 2026

For years, data-center performance scaled by following a familiar playbook: faster GPUs, higher SerDes rates, and increasingly aggressive board designs….

By Tony Mastroianni

5 MIN READ

Six Key Trends Redefining 3D IC Packaging in the AI Era

February 5, 2026

Some say we are officially in the Post-Moore’s Law world.  Moore himself closed his seminal paper by mentioning the “day…

By Pratyush Kamal

5 MIN READ

3D IC thermal challenges and trends 2026

Key Thermal Advances Driving Next-Gen AI Chip Design in 2026

December 15, 2025

AI is hot — literally. As we bid farewell to a transformative year of 2025, there’s no doubt that the AI chip underwent substantial changes. As AI compute is pushing…

By Andras Vass-Varnai

3 MIN READ

Illustrative example of 3D IC heat dissipation - thermal management

IC package thermal resistance: Accurate modeling for system-level IC thermal reliability

August 19, 2025

As semiconductor devices grow more powerful and complex, effective thermal management has become a top priority in IC design. With…

By John McMillan

6 MIN READ

IC Package Types Explained: BGA, QFP, 2.5D, 3D IC and Chiplets

July 28, 2025

Integrated circuits (ICs) are the foundation of modern electronics, powering everything from smartphones and medical devices to servers and automotive…

By John McMillan

7 MIN READ

2.5D vs. 3D IC: which chip packaging technology is right for you?

June 24, 2025

Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional…

By John McMillan

6 MIN READ

3D IC rendering illustrating advanced chip packaging with vertically stacked dies

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

June 5, 2025

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip…

By John McMillan

6 MIN READ