chiplet integration with STCO system technology co optimization

Resolving Design Fragmentation Challenges in Chiplet Integration with STCO

Are you struggling to integrate chiplets into an advanced packaging platform due to design fragmentation challenges? The complexity of managing…

Heterogeneous integration eBook IC Packaging

How can IC and package designers navigate the complexities of heterogeneous integration?

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining…

Impacts of 3D IC on the future

3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic…

Revolutionizing semiconductors with 3D IC and chiplet technology

Each Industrial Revolution resulted in advancements that propelled humans forward into a seemingly different world. The first in 1784 was…

3D IC verification requires a golden netlist that allows exceptions

With current 3D IC packaging technologies, since the system-level netlist (the 3D IC design intent) drives system-level LVS verification, designers…

3D IC and the system-technology co-optimization (STCO) approach

3D IC and the system-technology co-optimization (STCO) approach

Semiconductor engineers aim to deliver best-in-class devices despite technology scaling and cost limitations of monolithic integrated circuit (IC) design. To…