Resolving Design Fragmentation Challenges in Chiplet Integration with STCO
Are you struggling to integrate chiplets into an advanced packaging platform due to design fragmentation challenges? The complexity of managing multiple chiplets, interposers, package BGAs, and PCBs can lead to fragmented design fractions that impact system performance and cost implications.
One particular engineering challenge highlighted in our latest eBook is the reintegration of design fractions into an early package prototype for multi-physics analysis. This challenge arises from the need to assess the connectivity between design fractions and provide essential insights to the silicon team for potential reevaluation of partitioning strategies.
Conventional methods like device technology co-optimization (DTCO) often fall short in addressing these design fragmentation challenges, focusing on individual design elements in isolation without considering the overall system implications. This can result in unnecessary complexity at the system package assembly level, affecting overall performance and cost-effectiveness.
In response to these challenges, the eBook introduces a novel methodology for system-level technology co-optimization (STCO) that empowers design engineers to overcome design fragmentation hurdles. By utilizing advanced design tools and adopting a system-centric approach, STCO enables engineers to optimize power, performance, area, cost, and reliability across silicon, packages, interposers, and PCBs.
Through STCO, design engineers can streamline chiplet integration into advanced packaging platforms by proactively addressing design fragmentation. The methodology facilitates architectural and technology trade-offs to achieve high-performance and cost-effective solutions efficiently, ensuring seamless integration and optimal system-level co-optimization.
To explore how STCO can help you tackle design fragmentation challenges and optimize chiplet integration, download our eBook. Equip yourself with the strategies and tools needed to overcome design hurdles and unlock the full potential of your chip integration project. Embrace STCO to revolutionize your chiplet integration process for enhanced efficiency and reliability, leaving design challenges behind.
