heterogeneous design

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A chip manufacturing line.

Streamlining AI device design using AI and Innovator3D IC Integrator

April 27, 2026

Two such STCO-related activities are now AI-powered in Innovator3D IC Integrator as part of the 2604 release and deliver superior results in an efficient predictable manner.

By Keith Felton
2 MIN READ
A chip manufacturing line.

What’s new in Innovator3D IC 2604

April 27, 2026

This latest Innovator3D IC release brings a raft of design capability and productivity enhancements to the product family, further enabling its ability to design for the latest AI and Hyperscaler devices using advanced heterogeneous integration platforms.

By Keith Felton
2 MIN READ
3d ic package design

HBM3e and HBM4: IC design guide for next-generation high bandwidth memory 

April 24, 2026

HBM3e (High Bandwidth Memory) is the current production-grade high bandwidth memory architecture, delivering over 1.2 TB/s per stack and powering the AI…

By Emily Yan
8 MIN READ
Abstract visual showing Interconnected data

Data, data, everywhere: Where did it come from, who owns it and is it the right version?

March 10, 2026

Knowing what is in your IC package design, where it came from, and who touched it last and when, is key to being able to verify with complete certainty and traceability your design’s current status. 

By Keith Felton
2 MIN READ
Screen shot of the Innovator3D IC canvas

The smart path to STCO with Hierarchical Device Planning (HDP)

February 20, 2026

Siemens partnered with Intel Foundry to develop a STCO centric capability that enables a “smart path” to homogeneous disaggregation using Hierarchical Device Planning and parameterized pin regions.

By Keith Felton
2 MIN READ
Abstract image of a chip. Text that says "What is 3Dblox?"

What is 3Dblox?

January 13, 2026

If you have not heard of it before, 3Dblox is an emerging standard that was first created by TSMC but is now managed by IEEE.

By Keith Felton
2 MIN READ
what's new Innovator3D IC 2510

What’s New in Innovator3D IC solution suite release 2510

October 27, 2025

Innovator3D IC solution suite release 2510 marks a groundbreaking first release of the comprehensive Innovator3D IC solution suite.

By Keith Felton
3 MIN READ

From 2.5D to true 3D IC: What’s driving the next wave of integration.​

October 8, 2025

With 3D IC integration blurring the lines between chip and package, is your team’s mindset truly system-centric, or are traditional…

By John McMillan
13 MIN READ
10 steps for successful heterogeneous chiplet integration

Unlock advanced chiplet design success: Discover the Siemens EDA Heterogeneous Integration eBook series

September 25, 2025

The future of semiconductor innovation is rapidly shifting from monolithic chips to advanced, multi-chiplet architectures. As devices demand greater power,…

By Tova Levy
4 MIN READ