​3D IC technology trends: how advanced IC packaging is changing the semiconductor industry

The semiconductor industry is rapidly evolving with 3D IC technology and advanced packaging solutions revolutionizing chip design and manufacturing. In…

Illustration of 3D IC stacked design

3D IC technology: your comprehensive guide to enabling heterogeneous integration

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

chiplet integration with STCO system technology co optimization

Resolving Design Fragmentation Challenges in Chiplet Integration with STCO

Are you struggling to integrate chiplets into an advanced packaging platform due to design fragmentation challenges? The complexity of managing…

Heterogeneous integration eBook IC Packaging

How can IC and package designers navigate the complexities of heterogeneous integration?

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining…

3D IC design solutions: 2024 – Year in review

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

Image of a 3D IC with text that says TSMC 2024 NA OIP Ecosystem Forum

Join us at the TSMC 2024 NA OIP Ecosystem Forum

The TSMC 2024 North America OIP (Open Innovation Platform®) Ecosystem Forum is just around the corner, and Siemens EDA is…

User2User 2024: Chiplets for future automotive application: Fraunhofer

User2User 2024: Chiplets for future automotive application: Fraunhofer

Andy Heinig, Head of Department Efficient Electronics at Fraunhofer, explains why automotive is especially a good market and enabler for chiplets and presents different use cases for chiplets that are on the horizon.

A deep dive into HDAP LVS/LVL verification

EDA companies are developing tools and workflows to support HDAP (High-density advanced packaging) LVS/LVL verification. Though the data for achieving “signoff-level” confidence is a work in progress, EDA companies are providing tools that can adapt to different levels of data availability and enable HDAP designers to execute HDAP LVS/LVL flows that are both productive and beneficial.

Siemens 3D IC heterogeneous semiconductor packaging workflows catapult design teams into the future of IC design today.

Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging

Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging.