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What’s new in Innovator3D IC 2610

October 26, 2026

The Innovator3D IC 2610 release (available now on Support Center) brings a number of design capabilities and productivity enhancements further…

By Keith Felton
4 MIN READ

Scaling 3D IC design: Trends, challenges and practical workflows, Part 2

October 21, 2026

Managing strategic risk, cost of ownership and time-to-market in the AI era Authors: Kevin Rinebold and Andras Vass-Varnai, Ph.D.  In this second…

By John McMillan
13 MIN READ

Scaling 3D IC design: Trends, challenges and practical workflows

October 5, 2026

Part 1: The reticle limit, advanced packaging and the multiphysics challenge Authors: Kevin Rinebold and Andras Vass-Varnai, Ph.D. This blog…

By John McMillan
9 MIN READ
3D IC chip digital twin

Beyond the limits of silicon: Why 3D IC is the next frontier of innovation

September 17, 2026

Guest author: Bob Patti, President of NHanced Semiconductors For decades, the semiconductor industry followed a predictable rhythm: shrink the transistors,…

By Tova Levy
2 MIN READ
A 3D IC illustration

Streamlining 3D IC design: A complete eBook series for building smarter, faster, and more predictable 3D IC workflows

July 21, 2026

Explore the full Streamlining 3D IC design eBook series and discover how Siemens methodologies and tools can help your team accelerate innovation, improve design quality, and manage the complexity of advanced 2.5D and 3D IC development.

By Keith Felton
5 MIN READ
What's new in Innovator3D IC 2604.002

Innovator3D IC Integrator 2604.002: Faster pathfinding for advanced 3D IC and chiplet design

July 8, 2026

As advanced packaging and chiplet-based architectures continue to push design complexity higher, engineering teams need tools that move just as…

By Keith Felton
< 1 MIN READ
An image of a 3D IC from Innovator3D IC protocol analyzer software

Streamlining 3D IC design interface performance

May 26, 2026

If you are planning to design a high-performance multi-chiplet heterogeneously integrated package, then you know that to achieve design performance, the integration between the logic chiplets is key.

By Keith Felton
< 1 MIN READ
An image of a 3D IC and 2.5D structure.

Streamlining power integrity analysis for 3D IC designs

May 11, 2026

The rules of semiconductor scaling have changed. With traditional transistor scaling slowing, advanced packaging has emerged as the primary driver…

By Sudarshan Deo and Muhammad Hassan
5 MIN READ
A chip manufacturing line.

Streamlining AI device design using AI and Innovator3D IC Integrator

April 27, 2026

Two such STCO-related activities are now AI-powered in Innovator3D IC Integrator as part of the 2604 release and deliver superior results in an efficient predictable manner.

By Keith Felton
2 MIN READ