Taking 3DIC heterogeneous integration mainstream

In this presentation, we will explore the challenges introduced by 3DIC, the current state of the industry to address those challenges, the ecosystem needed to support 3DIC, and how users today can successfully adopt 3DIC leveraging new solutions, workflows, and 3DIC Design Kits (3DK) from Siemens EDA that are designed specifically with 3DIC in mind.

User2User 2024: Meeting future performance demands through packaging: ChipletZ

Learn how 3DIC tech enhances compact, high-performance systems but faces verification challenges. We explore solutions and methodologies, including the use of Siemens XSI and Calibre 3DSTACK.

Enabling comprehensive DFT for chiplets and 3DICs using Tessent Multi-die

Learn about Siemens’ Tessent Multi-die solution for 3DIC packaging.

User2User 2024: Silicon photonics to integrate chiplets: Swissbit

Swissbit is pioneering chiplet and system-on-package solutions that embed security and functional safety from the design phase to meet stringent requirements in harsh industrial and automotive environments.

User2User 2024: Chiplets for future automotive application: Fraunhofer

User2User 2024: Chiplets for future automotive application: Fraunhofer

Andy Heinig, Head of Department Efficient Electronics at Fraunhofer, explains why automotive is especially a good market and enabler for chiplets and presents different use cases for chiplets that are on the horizon.

The evolution of machine learning (ML) in the physical design and verification of semiconductor packages

Discover how Siemens’ EDA evolution of machine learning in the physical design and verification of semiconductor packages.

User2User 2024: EMIB based advanced packaging flow – Intel Foundry

Learn how Intel uses 3DIC verification to leverage Siemens XSI & Calibre 3DSTACK for DRC, LVS, assembly checks. Explore methodologies for high-performance systems.

Why is a comprehensive workflow essential for chiplet design and today’s 3D IC architectures?

Explore this infographic to learn why a comprehensive workflow essential for chiplet design and today’s 3D IC architectures.

The multi-physics challenge: Known good die may not behave in 3D IC as stand alone!

Discover how Siemens’ EDA tackles the multi-physics challenge to achieve fast, accurate assembly-level physical verification.