Product: Xpedition IC Packaging

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The role of AI-infused EDA solutions for semiconductor-enabled products and systems

July 23, 2024

Discover why semiconductor-enabled products and systems are demanding AI-infused solutions and how AI is changing the nature of semiconductor design.

By John McMillan
2 MIN READ
Image showing physical design IP reuse with Xpedition Package designer

Embracing physical design IP reuse as a best practice

July 22, 2024

Efficiency in IC package design is becoming more important as design cycles shorten and complexity surges. One common approach to…

By Keith Felton
2 MIN READ

Discover how AI is changing the nature of semiconductor design

July 16, 2024

AI is shaping the semiconductor industry’s future and its alignment with Siemens’ commitment to innovation and enhancing sustainability by accelerating…

By John McMillan
2 MIN READ
Assembly Verification Flow for Silicon Interposers with Embedded Deep Trench Capacitance

User2User 2024: Assembly verification flow for silicon interposers

July 15, 2024

In this User2User 2024 session Broadcom’s Suvarna Vikhankar presents “Assembly Verification Flow for Silicon Interposers with Embedded Deep Trench Capacitance”

By John McMillan
2 MIN READ
New innovative way to functionally verify heterogeneous 2D/3D package connectivity

New innovative way to functionally verify heterogeneous 2D/3D package connectivity

June 6, 2024

This blog introduces a white paper that addresses the challenges of verifying
package connectivity and illustrated how to use formal tools to verify connectivity for package designs.

By John McMillan and Todd Burkholder
3 MIN READ
Two people working at a white board with text onscreen that says: Multiplying engineering resources for efficient package substrate design

Multiplying engineering resources for efficient package substrate design

May 14, 2024

In the world of package substrate design, the age-old saying, “many hands make light work,” holds more truth than ever….

By Keith Felton
2 MIN READ
Image of a chip with text that says: High Bandwidth Memory integration

Managing the complexities of High Bandwidth Memory integration in high-performance computing

March 12, 2024

The utilization of High Bandwidth Memory (HBM) has become a cornerstone for high performance computing (HPC) CPUs, GPUs, and AI…

By Keith Felton
2 MIN READ
Taking 2.5D/3D IC physical verification to the next level

Taking 2.5D/3D IC physical verification to the next level

February 21, 2024

Taking 2.5D/3D IC physical verification to the next level. As package designs continue to evolve, so must the verification requirements. Designers working on even the most complex multi-die, multi-chiplet stacked configurations require enhanced checking capabilities to quickly and easily verify that the physical die are placed correctly to ensure proper connectivity and electrical behavior.

By John McMillan
4 MIN READ

A deep dive into HDAP LVS/LVL verification

January 29, 2024

EDA companies are developing tools and workflows to support HDAP (High-density advanced packaging) LVS/LVL verification. Though the data for achieving “signoff-level” confidence is a work in progress, EDA companies are providing tools that can adapt to different levels of data availability and enable HDAP designers to execute HDAP LVS/LVL flows that are both productive and beneficial.

By John McMillan
4 MIN READ