The key analysis needs of high-performance computing semiconductor package design Today, power requirements are continually increasing as you bring more…
Designs are just getting bigger and more complex Yes, an obvious aspect is increasing design complexity. Packages are now a…
The connectivity management complexity of package assemblies where multiple chiplets/ASICs and memory are heterogeneously integrated, introduces a great deal of…
The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…
If you’re designing a high-performance processor-based package, it’s common for the semiconductor package design to contain multiple logic chips that…
People have been designing “modules” or system-in-packages (SiP) for a number of years; but in the last 3-5 years, I…
“Golden signoff” – The final step in the semiconductor packaging process In my last blog post, I talked about the…
In our fifth podcast on 3D IC design workflows, we discussed what a 3D IC physical design workflow looks like,…
Scalability and range of IC packaging design solutions In my last blog, I talked about multi-domain and cross-domain integration that…
