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What’s new in Innovator3D IC 2604

Streamlining 3D IC Design with Innovator3D IC 2604

This latest Innovator3D IC release brings a raft of design capability and productivity enhancements to the product family, further enabling its ability to design for the latest AI and Hyperscaler devices using advanced heterogeneous integration platforms. One major area of focus for 2604 was introducing AI to power a number of complex functions that without AI would be very time consuming and error prone. Those capabilities are covered in greater detail in another blog post. Here is a preview of the non-AI major new capabilities. 

Innovator3D IC Integrator

  • System netlist comparator with graphical debugger 
    • Early pathfinding SVS (Schematic-Verses-Schematic) comparison can prevent later stage detailed LVS/assembly issues causing a design spin. 
    • A graphical comparator provides checking/debugging allowing designers to quickly pinpoint issues such as missing pins, superfluous pins, superfluous pins on a foreign net as well as pins connected to the wrong net. 
  • Comprehensive 3Dblox support 
    • Support for all revisions/versions of 3Dblox. 
  • Expanded early predictive analysis capabilities for silicon substrates with resistivity calculation of the planned on silicon interconnect 
  • New unravel/connectivity optimizer across devices and substrates 
  • Net length reporting and netline crossing congestion visualization and reporting 
    • Assist’s designer in better route channel planning. 
  • Centralized property manager provides consistent use model for adding properties to objects used in early predictive analysis and downstream processes. 
  • Internal ASIC/chiplet connectivity now used for daisy-chain test vehicle design 
  • New high-performance multi-threaded virtual die model provides interactive performance on design of 5M+ pin designs 
  • Direct import of Calibre verification results provides a streamlined debugging flow.  
  • Export to Tessent Diagnosis for early yield failure prediction 

Innovator3D IC Layout

  • New ultra-fast GDSII export engine  
  • Interactive, batch and forward annotation performance tested on 24 million pin design with 2 million nets  

Innovator3D IC Protocol Analyzer

  • Advanced Solver material mapping/management  
    • Integration with Calibre that recreates nets, pins, embedded materials, etc. from shape properties.  
    • Calibre enhancements include MIPT to .tech file translator enabling in-die table support.  

Innovator3D IC Data Management

  • Tighter design integration  
    • Ability to check in local designs. Design meta-data directly visible through Innovator3D IC Data Management cockpit, no need to open design to view meta data. Import all packaging design source data/IP directly.  

As you can see 2604 is rich is new capabilities that boost design capability and productivity.

Keith Felton

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/semiconductor-packaging/2026/04/27/whats-new-in-innovator3d-ic-2604/