What’s new in IC Packaging 2504

The world of integrated circuit (IC) package design is rapidly evolving, driven by the increasing complexity of advanced packaging technologies. To help design teams stay ahead of the curve, Siemens has released the comprehensive 2504 update for its Innovator3D IC (i3D) and Xpedition Package Designer (xPD) solutions.

This release introduces a host of new features and capabilities that elevate the IC package design process, empowering engineers to tackle the most intricate challenges with greater efficiency and precision.

Work-in-Progress (WiP) data management with EDM-P

One of the key highlights of the 2504 update is the introduction of the optional Engineering Data Management for IC Packaging (EDM-P) capability. This feature brings comprehensive revision control and collaboration to the i3D and xPD databases, ensuring design integrity and seamless teamwork throughout the development lifecycle.

EDM-P manages the integration “snapshot” file as well as all the design IP source files, such as CSV, Verilog, Lef/Def, GDSII, and OASIS. By tracking every aspect of the project, design teams can verify exactly which source files were used in the design before taping out, eliminating costly errors.

The WiP data management functionality allows designers to check in and check out design revisions, ensuring that the entire team is working on the most up-to-date version of the project. This level of version control and collaboration is crucial in the face of the increasing complexity and distributed nature of modern IC package design.

Comprehensive 3Dblox certification and compliance

Another significant enhancement in the 2504 release is the seamless integration of 3Dblox file support in i3D. This industry-standard format contains a complete package assembly, supporting all three data stages: Blackbox, Lef/Def, and GDSII.

i3D now can both import and export 3Dblox files, enabling it to drive the downstream design, analysis, and verification ecosystem. This comprehensive 3Dblox certification and compliance ensures that designers can work with a wide range of 3Dblox data, regardless of its source, and maintain a cohesive and streamlined design workflow.

Furthermore, i3D includes a built-in debugger that can identify and resolve any 3Dblox syntax issues during the file read process. This feature is particularly valuable when dealing with 3Dblox files from third-party sources, helping designers quickly identify and address any potential problems.

Predictive design planning and analysis

To deliver more actionable results and insights, the 2504 release of i3D introduces several new capabilities that enhance predictive design planning and analysis. These include the ability to prototype power and ground planes, as well as the integration of Unified Power Format (UPF) import, which enables more accurate signal integrity, power integrity, and thermal analysis.

One of the significant challenges in multi-chiplet heterogeneous integration is the complexity of design-for-test (DFT) planning. To address this, i3D has integrated Tessent’s multi-die capability, allowing designers to seamlessly incorporate DFT considerations into their overall design process.

By enabling these advanced predictive planning and analysis features, i3D empowers designers to make more informed decisions, identify potential issues earlier in the design cycle, and ultimately deliver higher-quality IC packages.

AI-Driven predictive commands

Enhancing designer productivity is a key focus of the 2504 release, and i3D introduces a groundbreaking feature to achieve this: AI-driven predictive commands.

This innovative capability learns from a user’s design patterns and preferences, and then suggests the next likely command they will want to use. By anticipating the designer’s needs and streamlining the workflow, these AI-powered predictive commands can significantly boost productivity and efficiency.

This intelligent user experience enhancement is a testament to Siemens’ commitment to leveraging the power of artificial intelligence to optimize the design process and empower engineers to work smarter, not harder.

Metal density calculation and connectivity optimization

As advanced IC packages incorporate more ASICs, chiplets, and high-bandwidth memory (HBM), the complexity of connectivity and routing has increased dramatically. To address this challenge, the 2504 release introduces a new, ground-up designed Connectivity Optimizer in i3D.

This advanced optimization engine can handle the emerging complexity of designs, including the optimization of differential pairs, ensuring that designers can achieve optimal routing and connectivity even in the most intricate package designs.

Complementing the Connectivity Optimizer, i3D also introduces a metal density reporting function. This feature allows designers to analyze metal density across the device and floorplan, enabling the development of bump patterns that minimize warpage and stress. By providing this valuable insight, i3D empowers designers to make more informed decisions and mitigate potential issues early in the design process.

Xpedition Package Designer improvements

The 2504 release also includes a range of productivity and performance enhancements to the Xpedition Package Designer (xPD) module. These improvements include the ability to export design areas with filtering for targeted analysis, as well as support for embedded Deep Trench Capacitors (eDTC) in manufacturing outputs.

The export-by-area functionality is particularly useful when detailed analysis, such as 3DEM modeling, is only required on a specific section of the design. By allowing designers to selectively export the relevant areas, this feature makes the exchange of information between layout and analysis tools more efficient, saving time and resources.

Furthermore, the eDTC filtering capability during manufacturing output ensures that designers can seamlessly integrate these specialized components into the fabrication process without any unnecessary complications.

Unlock the next level of innovation

With these powerful new features and capabilities, the Xpedition and Innovator3D IC 2504 release empowers design teams to tackle the most complex IC package design challenges with greater efficiency, collaboration, and confidence.

From comprehensive data management and 3Dblox compliance to advanced predictive planning, AI-driven productivity enhancements, and optimized connectivity, this release represents a significant step forward in the world of IC package design.

By unlocking the next level of innovation, Siemens is equipping design teams with the tools they need to stay ahead of the curve, deliver higher-quality IC packages, and drive the industry forward. Embrace the transformative power of Xpedition Package Designer and Innovator3D IC 2504 and elevate your IC package design workflows today.