​Why Traditional PCB Methods Fall Short in 3D IC Design

In this episode of the Siemens 3D IC Podcast Series,we delve into the world of FOWLP (Fan-out wafer-level packaging) with…

3D IC rendering illustrating advanced chip packaging with vertically stacked dies

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip…

​3D IC technology trends: Microarchitecture in IC design

In this latest Siemens EDA 3D IC podcast episode, we explore microarchitecture’s crucial role in 3D IC design. Listen in…

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🎧 Subscribe to the 3D IC podcast — your front row seat to the future of chip design

Listen now on your favorite platform: 🔹 Spotify🔹 Apple Podcasts🔹 Amazon Music🔹 YouTube Playlist 👉 Don’t forget to bookmark the…

​3D IC technology trends: how advanced IC packaging is changing the semiconductor industry

The semiconductor industry is rapidly evolving with 3D IC technology and advanced packaging solutions revolutionizing chip design and manufacturing. In…

Illustration of 3D IC stacked design

3D IC technology: your comprehensive guide to enabling heterogeneous integration

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

Siemens Xcelerator X with a 3D PCB inside

What’s new in IC Packaging 2504

To help design teams stay ahead of the curve, Siemens has released the comprehensive 2504 update for its Innovator3D IC (i3D) and Xpedition Package Designer (xPD) solutions.

Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and…

Screen shots of Innovator3D IC software in use.

Exploring TSMC InFO_oS and InFO_PoP certification

Siemens EDA has recently achieved this certification for Xpedition Package Designer as part of the TSMC InFO_oS and InFO_PoP workflows.