The demand for increased power and performance in semiconductor packages has surged. As more die and chiplets are integrated into…
Designing advanced package layouts with large areas of metal can be a daunting task, given the stringent requirements imposed by…
The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package…
The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…