The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…
In our last 3D IC blog, we talked about the impact of 3D IC on device reliability. In today’s blog,…
If you’re designing a high-performance processor-based package, it’s common for the semiconductor package design to contain multiple logic chips that…
Each Industrial Revolution resulted in advancements that propelled humans forward into a seemingly different world. The first in 1784 was…
People have been designing “modules” or system-in-packages (SiP) for a number of years; but in the last 3-5 years, I…
“Golden signoff” – The final step in the semiconductor packaging process In my last blog post, I talked about the…
So far in our 3D IC blog series, we’ve discussed front-end design approaches to develop 3D IC-based devices, the importance…
In our fifth podcast on 3D IC design workflows, we discussed what a 3D IC physical design workflow looks like,…
Scalability and range of IC packaging design solutions In my last blog, I talked about multi-domain and cross-domain integration that…
