Want to know what went on at the TSMC OIP Forum this year? Here’s the inside scoop…

TSMC customers and partners always look forward to the annual TSMC Open Innovation Platform® (OIP) Forums. Here, they get the opportunity to learn how other companies are working with TSMC to bring innovative technologies to market, and how partners such as Siemens Digital Industries Software are supporting those efforts with cutting-edge EDA tools that can improve design and verification methodology, shorten delivery time, and ensure high-yielding and high-performing products.

As part of the program, the TSMC OIP Forum hosts a variety of technical presentations discussing the latest technologies and design solutions. Representing Calibre Design Solutions this year were Michael White, the senior director of physical verification product management, and Hend Wagieh, senior product engineering manager,

Michael’s presentation, Accelerating Design Time to Market Leveraging Innovations with Calibre nmDRC, on AMD Milan in the Microsoft Azure Cloud, explains how Siemens EDA is accelerating both design time to market and ease of use by enabling Calibre customers to leverage cloud computing resources. In partnership with TSMC, AMD, and Microsoft, the Calibre team worked to optimize the Calibre toolsuite for cloud operations and resources to ensure their joint customers can realize the full benefit of their cloud investments.

In Expediting the Circuit Verification Closure Cycle with Calibre® nmLVS Reconnaissance, Hend discusses how the innovative Calibre nmLVS Recon functionality enables designers to concentrate only on the problematic areas in their early designs, such as short circuits, ERC/path checks, and soft checks violations. The immediate feedback from the Calibre nmLVS Recon technology focuses on actionable results that facilitate root cause analysis and debugging among multiple designers, helping them close their verification cycle faster while minimizing hardware usage.

Even if you weren’t able to attend the TSMC OIP Forum in real time, you can now view these and other technical presentations, as well as visit Siemens EDA in the Partner Pavilion, for a limited time by registering here.

If you miss the window, don’t worry! We’ll also be making the Siemens presentations available at a later date. Stay tuned for details…

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/calibre/2021/11/03/want-to-know-what-went-on-at-the-tsmc-oip-forum-this-year-heres-the-inside-scoop/