Tova Levy
From chips to silicon destiny: Siemens' Piyush Sancheti on the next wave of 3D IC

From chips to silicon destiny: Siemens' Piyush Sancheti on the next wave of 3D IC

August 12, 2026
We see a lot of activity with many new avenues being explored, whether that’s new device types, new material types,...
By Tova Levy
< 1 MIN READ
From hype to engineering: How AI actually works in 3D IC design

From hype to engineering: How AI actually works in 3D IC design

August 5, 2026
Five years ago, if you would have imagined, you know, Cursor or Chat GPT, even all of these skill frameworks...
By Tova Levy
< 1 MIN READ
Beyond the silo: Managing data at the speed of 3D IC design

Beyond the silo: Managing data at the speed of 3D IC design

July 29, 2026
PLM manages product-level changes — things like ideation, supply chain, manufacturing, and demand. IPLM, on the other hand, is designed...
By Tova Levy
< 1 MIN READ
The wire problem: Why advanced packaging is the only answer left as Moore's Law runs out

The wire problem: Why advanced packaging is the only answer left as Moore's Law runs out

July 22, 2026
“The average user uses only 30% of the transistors in their cell phone. If you could now affordably reduce the...
By Tova Levy
< 1 MIN READ
From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands

From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands

July 15, 2026
“The first call would be for all our EDA partners to shift from a tool-centric thinking to a system level...
By Tova Levy
< 1 MIN READ
Proactive BOM analysis: Turning supply chain risk into competitive advantage

Proactive BOM analysis: Turning supply chain risk into competitive advantage

July 14, 2026
What if the part you approved in five minutes ends up costing your company ten million dollars down the line?...
By Tova Levy
< 1 MIN READ
The hidden time bomb: Engineering reliability into 3D IC from day one

The hidden time bomb: Engineering reliability into 3D IC from day one

July 8, 2026
“Do not treat reliability as an afterthought, something which you just do at the very end of the design process,...
By Tova Levy
< 1 MIN READ
Communication, trust, process: The three pillars every co-design team must get right

Communication, trust, process: The three pillars every co-design team must get right

June 30, 2026
“If you started back in the light table taping days and you decided that when the first CAD tools came...
By Tova Levy
< 1 MIN READ
Beyond the data pipe: Why connectivity IP is now the system-critical layer in every 3D IC

Beyond the data pipe: Why connectivity IP is now the system-critical layer in every 3D IC

June 24, 2026
What does it actually mean for connectivity IP to stop being a supporting function — and become the layer that...
By Tova Levy
< 1 MIN READ
The library is the foundation: Why design reuse is energy conservation

The library is the foundation: Why design reuse is energy conservation

June 23, 2026
My electric car is a Tesla, and it drives itself. All of a sudden, it’s trying to turn onto a...
By Tova Levy
< 1 MIN READ
Trust is good, control is better: Designing hardware faster without betting it all on AI

Trust is good, control is better: Designing hardware faster without betting it all on AI

June 17, 2026
When working with AI… the user, the engineer in our case has to be the one making the decisions. AI...
By Tova Levy
< 1 MIN READ
Drop it in the river: The surprisingly simple philosophy behind manufacturing 2,000+ circuit boards with a tiny team

Drop it in the river: The surprisingly simple philosophy behind manufacturing 2,000+ circuit boards with a tiny team

March 22, 2026
What if the wrong click turned out to be the right one? And once you’re in the industry, how do...
By Tova Levy
< 1 MIN READ
Thermal management in 3D IC: Challenges, modeling and design strategies 

Thermal management in 3D IC: Challenges, modeling and design strategies 

January 26, 2026
You are likely here because thermal issues have become the primary constraint shaping your 3D IC design decisions. As 3D integration pushes more performance into smaller footprints, thermal...
By Tova Levy
< 1 MIN READ
Ensure 3D IC Multiphysics Reliability for AI Systems at Scale

Ensure 3D IC Multiphysics Reliability for AI Systems at Scale

January 18, 2026
Every new generation of AI systems pushes SoC design teams closer to the end of Moore’s Law. The core question...
By Tova Levy
< 1 MIN READ
Defense-grade design: Mentorship, reliability, and the next wave of PCB innovation

Defense-grade design: Mentorship, reliability, and the next wave of PCB innovation

December 12, 2025
How do you train the next generation of PCB engineers when the veterans are retiring faster than they can be...
By Tova Levy
< 1 MIN READ
Unlock advanced chiplet design success: Discover the Siemens EDA Heterogeneous Integration eBook series

Unlock advanced chiplet design success: Discover the Siemens EDA Heterogeneous Integration eBook series

September 25, 2025
The future of semiconductor innovation is rapidly shifting from monolithic chips to advanced, multi-chiplet architectures. As devices demand greater power,...
By Tova Levy
< 1 MIN READ
From 2.5D to true 3D IC: What’s driving the next wave of Integration

From 2.5D to true 3D IC: What’s driving the next wave of Integration

September 18, 2025
How do you transition from today’s 2.5D systems into tomorrow’s true 3D IC architectures — while balancing cost, performance, and...
By Tova Levy
< 1 MIN READ
Why every 3D IC needs a test vehicle before it hits production

Why every 3D IC needs a test vehicle before it hits production

September 4, 2025
How do you ensure that cutting-edge 3D IC designs can actually be manufactured before investing millions in production? In this...
By Tova Levy
< 1 MIN READ
Breaking down 50 million pins: A smarter way to design 3D IC packages

Breaking down 50 million pins: A smarter way to design 3D IC packages

August 21, 2025
How do you design and verify a package with tens of millions of pins — without losing months to manual...
By Tova Levy
< 1 MIN READ
The Missing Piece for Chiplet Success

The Missing Piece for Chiplet Success

August 11, 2025
Chiplets are revolutionizing the semiconductor industry, enabling unprecedented levels of integration, performance, and flexibility. By breaking complex designs into smaller,...
By Tova Levy
< 1 MIN READ
Why SI/PI is Mission-Critical for 3D IC Success

Why SI/PI is Mission-Critical for 3D IC Success

August 7, 2025
How do you ensure clean, stable power and reliable signal transmission in a dense 3D IC stack without introducing late-stage...
By Tova Levy
< 1 MIN READ
From chiplets to systems: Overcoming the hidden pitfalls of 3D IC design

From chiplets to systems: Overcoming the hidden pitfalls of 3D IC design

July 24, 2025
In this episode of the Siemens 3D IC Podcast, host John McMillan is joined by returning guest John Ferguson, Senior...
By Tova Levy
< 1 MIN READ
Mastering interface planning and predictive analysis in IC design

Mastering interface planning and predictive analysis in IC design

July 16, 2025
From optimizing connectivity to ensuring electrical performance, designers are tasked with meticulous planning and execution to achieve seamless communication and...
By Tova Levy
< 1 MIN READ
Navigating the Transition to Automated DFM Solutions in Automotive Electronics

Navigating the Transition to Automated DFM Solutions in Automotive Electronics

July 15, 2025
In the fast-paced world of automotive electronics, staying ahead of the curve is essential. With the rapid advancements in technology...
By Tova Levy
< 1 MIN READ
Why 3D ICs Need a Mindset Shift—and How to Make It Happen

Why 3D ICs Need a Mindset Shift—and How to Make It Happen

July 10, 2025
What does it take to turn 3D IC from a buzzword into a successful reality, and how early should you...
By Tova Levy
< 1 MIN READ
The Hidden Heat Challenge of 3D ICs—and What Designers Need to Know

The Hidden Heat Challenge of 3D ICs—and What Designers Need to Know

June 26, 2025
Why is thermal analysis no longer an afterthought in 3D IC design—and what is Siemens doing to empower engineers across...
By Tova Levy
< 1 MIN READ
Why traditional PCB methods fall short in 3D IC design

Why traditional PCB methods fall short in 3D IC design

June 12, 2025
Why are companies rapidly adopting fan-out wafer-level packaging (FO-WLP)—and how does this shift impact the traditional chip design process? In...
By Tova Levy
< 1 MIN READ
3D IC is here: But is your architecture ready for it?

3D IC is here: But is your architecture ready for it?

May 29, 2025
As 3DIC adoption ramps up, it’s becoming clear: microarchitecture needs a rethink. So how do you design hardware that can...
By Tova Levy
< 1 MIN READ
The future of 3D ICs: How advanced packaging is changing the industry

The future of 3D ICs: How advanced packaging is changing the industry

May 15, 2025
How are 3D Integrated Circuits (3D ICs) revolutionizing semiconductor design, and what role do advanced packaging technologies play in this...
By Tova Levy
< 1 MIN READ
Resolving Design Fragmentation Challenges in Chiplet Integration with STCO

Resolving Design Fragmentation Challenges in Chiplet Integration with STCO

May 11, 2025
Are you struggling to integrate chiplets into an advanced packaging platform due to design fragmentation challenges? The complexity of managing...
By Tova Levy
< 1 MIN READ
Siemens Innovator3D IC wins 2025 3D InCites Technology Enablement award

Siemens Innovator3D IC wins 2025 3D InCites Technology Enablement award

April 2, 2025
In the fast-evolving landscape of semiconductor technology, innovation and collaboration are key drivers of progress. As advanced interconnect and packaging...
By Tova Levy
< 1 MIN READ
How can IC and package designers navigate the complexities of heterogeneous integration?

How can IC and package designers navigate the complexities of heterogeneous integration?

March 19, 2025
Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining...
By Tova Levy
< 1 MIN READ
Advanced tools aren’t everything: optimizing electronics design workflows

Advanced tools aren’t everything: optimizing electronics design workflows

September 26, 2024
Electronics design is challenging not only from a technical perspective; workflow practices and organizational culture can also stand in the...
By Tova Levy
< 1 MIN READ
How our users solve unique electronics design challenges

How our users solve unique electronics design challenges

September 3, 2024
The annual User2User events bring together Siemens EDA users for a day of learning and connecting with peers, and since...
By Tova Levy
< 1 MIN READ
When automated processes actually slow down production

When automated processes actually slow down production

October 23, 2023
And how AI can help to solve bottlenecks caused by automated inspection Automated optical inspection (AOI) machines are used in...
By Tova Levy
< 1 MIN READ
Teamwork and creativity for sustainable manufacturing

Teamwork and creativity for sustainable manufacturing

July 17, 2023
Podcast #6 in our new series with I-Connect007: Sustainability in Electronics Manufacturing Creating a more sustainable manufacturing environment is essential...
By Tova Levy
< 1 MIN READ
Sustainability in logistics: inside and outside the factory

Sustainability in logistics: inside and outside the factory

July 2, 2023
Podcast #4 and #5 in our new series with I-Connect007: Sustainability in Electronics Manufacturing Logistics is a critical aspect of...
By Tova Levy
< 1 MIN READ
Webinar: For accurate PCB quoting, you need more than Excel

Webinar: For accurate PCB quoting, you need more than Excel

June 28, 2023
Accurate job quoting is key to good business While EMS companies compete for manufacturing jobs, they need to generate quotes...
By Tova Levy
< 1 MIN READ
Efficiency is key to more sustainable manufacturing

Efficiency is key to more sustainable manufacturing

June 20, 2023
Podcast #3 in our new series with I-Connect007: Sustainability in Electronics Manufacturing As we become more aware of our impact...
By Tova Levy
< 1 MIN READ
How do cloud applications advance sustainability?

How do cloud applications advance sustainability?

June 7, 2023
Podcast #2 in our new series with I-Connect007: Sustainability in Electronics Manufacturing Our latest podcast episode features Susan Kayesar, PCBflow...
By Tova Levy
< 1 MIN READ
Sustainable PCB design with the digital twin

Sustainable PCB design with the digital twin

June 1, 2023
Podcast #1 in our new series with I-Connect007: Sustainability in Electronics Manufacturing Sustainability is becoming increasingly crucial in the manufacturing...
By Tova Levy
< 1 MIN READ
What can electronics manufacturers do about the labor crisis?

What can electronics manufacturers do about the labor crisis?

March 29, 2023
Watch the webinar on-demand to learn how digitalization can help. There is an estimated shortage of 85 million workers worldwide...
By Tova Levy
< 1 MIN READ
How technology can lower utility and equipment costs

How technology can lower utility and equipment costs

March 9, 2023
Electronics manufacturers can no longer afford to overlook the rising cost of energy consumption. The electricity consumption of manufacturing equipment...
By Tova Levy
< 1 MIN READ
Wanted: qualified workers. Now!

Wanted: qualified workers. Now!

February 8, 2023
Why is it especially difficult for SMBs to hire skilled employees? Success in a knowledge-based industry like electronics manufacturing is...
By Tova Levy
< 1 MIN READ
Overcoming component shortages for SMBs

Overcoming component shortages for SMBs

January 18, 2023
The 2nd article in our series on challenges facing SMB electronics manufacturers. Electronic products are an essential part of modern...
By Tova Levy
< 1 MIN READ
The challenges facing SMB electronics manufacturers

The challenges facing SMB electronics manufacturers

December 19, 2022
A four-part series by guest author Marius Stepanescu, Technical Director at ICCO EMT Small-to-medium-sized (SMB) electronics manufacturers in the electronics...
By Tova Levy
< 1 MIN READ
3 Creative Solutions for the Component Shortage Crisis

3 Creative Solutions for the Component Shortage Crisis

October 24, 2022
In the fourth of a series of WNIE podcasts, Zac Elliot – Technical Marketing Engineer at Siemens Digital Industries Software...
By Tova Levy
< 1 MIN READ
Effectively Managing Electronic Component Vendors as the Supply Chain Widens

Effectively Managing Electronic Component Vendors as the Supply Chain Widens

October 18, 2022
In the third of a series of WNIE podcasts, Mark Laing – Business Development Manager at Siemens Digital Industries Software...
By Tova Levy
< 1 MIN READ
Solving supply chain instability in the PCB design stage

Solving supply chain instability in the PCB design stage

October 6, 2022
In the second of a series of WNIE podcasts, Susan Kayesar – PCBflow Product Manager at Siemens Digital Industries Software...
By Tova Levy
< 1 MIN READ
3 Strategies for Coping with Supply Chain Instability and Component Shortages

3 Strategies for Coping with Supply Chain Instability and Component Shortages

October 3, 2022
In the first of a series of WNIE podcasts, Oren Manor – Director of Business Development for the Electronics Industry...
By Tova Levy
< 1 MIN READ
Cloud-based pricing automation reduces time and uncertainty in the PCB NPI process

Cloud-based pricing automation reduces time and uncertainty in the PCB NPI process

August 2, 2022
Current Industry Challenges In an industry that utilizes cutting-edge technology, it is surprising to find that the design and purchasing...
By Tova Levy
< 1 MIN READ
GÖPEL and Siemens bring the digital twin to 3D AOI and SPI systems

GÖPEL and Siemens bring the digital twin to 3D AOI and SPI systems

April 25, 2022
Testing solutions company GÖPEL electronic has just released a new version of its PILOT AOI system software that offers the...
By Tova Levy
< 1 MIN READ
Valor Parts Library: What You Need to Know

Valor Parts Library: What You Need to Know

December 27, 2021
Validating the PCB footprint with a comprehensive component library Are you familiar with the Valor Parts Library? Whether you are...
By Tova Levy
< 1 MIN READ
The secret to profitable electronics manufacturing: On-demand webinar series

The secret to profitable electronics manufacturing: On-demand webinar series

November 2, 2021
First blog in a 12-part series covering the Digital Twin Best Practices in Electronics Manufacturing mini-webinar series by Jay Gorajia...
By Tova Levy
< 1 MIN READ
New white paper: Building the infrastructure for holistic, end-to-end manufacturing

New white paper: Building the infrastructure for holistic, end-to-end manufacturing

October 21, 2021
Learn how to boost efficiency with a holistic PCB manufacturing and assembly operation Demand for innovation is on the rise,...
By Tova Levy
< 1 MIN READ
Webinar: How to speed up NPIs with accurate, efficient quoting

Webinar: How to speed up NPIs with accurate, efficient quoting

August 25, 2021
Electronics companies are getting squeezed from every direction: under increasing pressure to get new products and customized versions out the...
By Tova Levy
< 1 MIN READ
How can data analytics reduce the cost of product recalls?

How can data analytics reduce the cost of product recalls?

August 17, 2021
Find out in a new article by Siemens’ big data analytics expert Yuval Polishuk Product recalls are a manufacturer’s worst...
By Tova Levy
< 1 MIN READ
Electronic component shortages: a hard job just got harder

Electronic component shortages: a hard job just got harder

April 26, 2021
… if you do not have the right tool. Post by guest author Ibrahim Gogus, CDT Last week, Jaguar Land...
By Tova Levy
< 1 MIN READ
High-mix, low-volume production: The challenge to manufacturing

High-mix, low-volume production: The challenge to manufacturing

March 24, 2021
Manufacturing today is all about customization—every consumer wants their unique own device. Mass customization is driving OEMs to create numerous...
By Tova Levy
< 1 MIN READ
Siemens BOM Connector: EDACafe Bunker Broadcast with Oren Manor

Siemens BOM Connector: EDACafe Bunker Broadcast with Oren Manor

March 22, 2021
New product introductions and customization have been increasing rapidly over the past few years – with the results that the...
By Tova Levy
< 1 MIN READ
Opcenter Intelligence Electronics: A powerful solution for big data analytics

Opcenter Intelligence Electronics: A powerful solution for big data analytics

February 1, 2021
Do you feel like you’re drowning in data? You’re not alone—PCB manufacturers today are required to maintain a full account...
By Tova Levy
< 1 MIN READ
Webinar: React quickly to PCB production changes

Webinar: React quickly to PCB production changes

January 27, 2021
Production schedules are like intricate domino lines. As long as each piece is perfectly positioned, everything goes like clockwork. However,...
By Tova Levy
< 1 MIN READ
Smart manufacturing in electronics – become a digital factory now

Smart manufacturing in electronics – become a digital factory now

November 9, 2020
These are challenging times. Social distancing forces necessary changes in the way electronics manufacturing has been managed and executed. At...
By Tova Levy
< 1 MIN READ
ODB++Process and its role in an ever-changing world

ODB++Process and its role in an ever-changing world

July 20, 2020
In the increasingly dynamic world of electronics manufacturing, in which production of a product may be required to migrate between...
By Tova Levy
< 1 MIN READ
Next47 2020 Virtual Demo - Join Us!

Next47 2020 Virtual Demo - Join Us!

July 14, 2020
In April 2020, the prestigious Next47 Accelerator program began.Our PCBflow team has been part of 12 amazing weeks of startup...
By Tova Levy
< 1 MIN READ
Digital transformation – succeed where others fail

Digital transformation – succeed where others fail

February 18, 2020
In a world that’s increasingly digitalized, companies are also expected to make the shift to digitalization. During the previous decade,...
By Tova Levy
< 1 MIN READ