GÖPEL and Siemens bring the digital twin to 3D AOI and SPI systems

Testing solutions company GÖPEL electronic has just released a new version of its PILOT AOI system software that offers the option to create and optimize inspection programs using a digital twin. PILOT AOI is the interface for operating 3D AOI and SPI systems for both SMD and THT inspection. The new capability speeds up the programming process and is a significant step toward a fully automated, fully operational inspection program.

Siemens Digital Industries Software worked closely with GÖPEL on the project to integrate support for the digital twin based on Siemens’ ODB++ Process language. It utilizes the Valor Data Prep Express tool for importing CAD and manufacturing data, which provides accurate component geometry including height information as well as information on the individual pin and solder joint position. This enables fully automated creation and optimization of AOI inspection programs, with no need for a real assembled board.

Read more about this in GÖPEL’s announcement.

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/valor/2022/04/25/gopel-and-siemens-bring-the-digital-twin-to-3d-aoi-and-spi-systems/