Advancing with digital twin and intelligent PCB programming: Siemens and GÖPEL electronic collaboration
July 6, 2026
At the GÖPEL electronic Test Convention, Siemens and GÖPEL electronic showcased how close collaboration is helping manufacturers address key challenges in modern SMT manufacturing. Learn how integrated digital solutions, powered by a comprehensive digital twin, connect product design, process planning, and shop floor execution to achieve first-time-right production and eliminate disconnected data flows.
By Bettina Richter - GÖPEL
2 MIN READ