The hidden time bomb: Engineering reliability into 3D IC from day one
“Do not treat reliability as an afterthought, something which you just do at the very end of the design process, but do it differently and consider reliability, both thermal and thermomechanical challenges, from the start of the design.”
-Andras Vass-Varnai, Siemens EDA
What happens when reliability can no longer be guaranteed by simply following the rules?
In this episode of the Siemens 3D IC Podcast, host Tova Levy speaks with Andras Vass-Varnai, Solution Architect for 3D IC reliability at Siemens EDA, about why reliability can no longer be guaranteed simply by following design rules — and what it takes to build it in from day one.
Andras explains why 3D IC breaks the old reliability playbook: in 2D packaging, reliability is largely baked into process rules, but the sheer number of design choices in 3D IC — stacking, floor planning, materials, cooling — means reliability has to be checked continuously, not verified at the end. He walks through the physics behind this: CTE mismatch between stacked materials causes warpage that accumulates with thermal cycling, ultimately leading to cracking or delamination — and breaks down where failures actually happen, with solder interconnects as the likely weak link, hybrid bonding as a manufacturing-sensitive but operationally strong alternative, and thermal interface materials as a make-or-break factor.
The conversation also covers the organizational side — how breakdowns in communication between thermal, electrical, and mechanical teams become reliability risks of their own — and Siemens’ approach to closing that gap through digital continuity, using Innovator3D IC Integrator to connect design disciplines, with a look ahead to how agentic AI could eventually automate the process. Andras closes with a clear message: break down the silos, and treat reliability as continuous from the start — not a final checkbox.
What you’ll learn
- (01:08) Andras’s path from Flomerics and MicReD to Siemens EDA
- (01:52) Why 3D IC reliability breaks from traditional 2D design
- (05:04) The physics of CTE mismatch: warpage, cracking, delamination
- (08:55) How performance-driven choices create a thermal time bomb
- (11:31) Why failures happen at interfaces: solder, hybrid bonding, TIMs
- (17:51) The human side: breaking silos between thermal, electrical, mechanical teams
- (21:53) Siemens’ digital continuity vision via Innovator3D IC Integrator
- (22:11) The path to automation: agentic AI, natural-language tools
- (26:43) Andras’s key message: don’t treat reliability as an afterthought
Andrass Vass-Varnai
Andras Vass-Varnai obtained his MSc and PhD degrees in Electrical Engineering from the Budapest University of Technology and Economics. He spent over a decade at Mentor Graphics as a product manager, leading various R&D projects focused on thermal test hardware and methodologies. Before assuming his current role as a 3D IC reliability solution engineer, Andras served as a business development lead in South Korea and the United States. Now based in Chicago, IL, he is dedicated to contributing to the development of a novel 3D IC package toolchain, leveraging his experience in thermal and reliability engineering.
Tova Levy
Tova Levy is a seasoned Content Producer and Manager at Siemens EDA, where she leverages her strong background in digital and content marketing strategy to plan and execute impactful content across various channels. Driven by a never-ending curiosity, Tova excels at distilling complex technical information into engaging, empathy-driven stories that resonate with B2B audiences. Her expertise lies in uncovering user pain points to create compelling narratives, consistently driving engagement and educating within the EDA technology space. Tova also produces the 3D IC podcast, transforming intricate engineering concepts into accessible, user-centric conversations.
3D IC
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