3D IC ecosystem

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3D IC podcast episode with Bob Patti

The wire problem: Why advanced packaging is the only answer left as Moore’s Law runs out

July 22, 2026

“The average user uses only 30% of the transistors in their cell phone. If you could now affordably reduce the…

By Tova Levy
2 MIN READ
3D IC podcast Ep with Sujit Sharan blog image

From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands

July 15, 2026

“The first call would be for all our EDA partners to shift from a tool-centric thinking to a system level…

By Tova Levy
2 MIN READ
3D IC podcast episode with Andras Vass-Varnai

The hidden time bomb: Engineering reliability into 3D IC from day one

July 8, 2026

“Do not treat reliability as an afterthought, something which you just do at the very end of the design process,…

By Tova Levy
2 MIN READ
3D IC podcast Ep #2 with Chris Jones Crypto Quantique

Zero trust in silicon: The new security imperative for chiplet-based 3D ICs

July 1, 2026

“You don’t just say, the other chiplet that’s on this die, I’m going to trust it, it’s fine. No —…

By Tova Levy
2 MIN READ