Stephen V. Chavez
Sr. Product Marketing Manager

Stephen Chavez is a veteran PCB designer who has used Siemens EDA tools for more than twenty years. As Senior Product Marketing Manager at Siemens, his role expands into thought leadership for supply chain resilience and electronic systems design.

Mastering the Bend: Essential Tips & Tricks for Rigid-Flex PCB Design

Mastering the bend: Essential tips & tricks for rigid-flex PCB design

October 15, 2025

Getting rigid-flex PCB design right requires a little know-how. To help you navigate the exciting world of bendable electronics, I’ve put together some essential tips and tricks.

By Stephen V. Chavez
4 MIN READ
Abstract image of a spine with PCB traces on top.

The invisible backbone of electronics: Why impedance matters more than you think

September 25, 2025

beneath the surface of every high-performance circuit lies an unsung champion: Impedance (Z).

By Stephen V. Chavez
4 MIN READ
An abstract picture of cloud security.

Keeping your IP safe in a connected world

August 19, 2025

Protecting electronic design IP isn’t just about having the right tools—it’s about cultivating a mindset across your organization.

By Stephen V. Chavez
4 MIN READ
Image of a hatched ground plane PCB

Understanding the impact of hatched ground planes on PCB impedance

July 7, 2025

Hatched ground planes can be employed and present an interesting alternative with specific implications for impedance control.

By Stephen V. Chavez
4 MIN READ
two engineers working remotely and collaborating in real-time

Remote collaboration in electronic systems design: How teams are building the future… from anywhere

June 18, 2025

Remote collaboration in ESD is no longer a stopgap nor isn’t just feasible. It’s a strategic shift. It’s a smarter, scalable way to build the future.

By Stephen V. Chavez
3 MIN READ
3D of a PCB

PCB high voltage spacing: What every engineer should know

April 29, 2025

At the heart of high-voltage PCB reliability is proper PCB high voltage spacing between conductive elements.

By Stephen V. Chavez
4 MIN READ
Aerial view of agricultural silos.

Beyond silos: Enabling multidomain and multidiscipline integration in electronic systems design

April 21, 2025

Engineering success depends not just on deep expertise, but on seamless integration across domains and disciplines.

By Stephen V. Chavez
4 MIN READ
Icons of file folders

Design for manufacturing output files – optimizing engineering to manufacturing efficiency

March 18, 2025

As PCB design and manufacturing become increasingly complex, the choice of design for manufacturing output files plays a crucial role in streamlining processes, reducing errors, and improving time to market.

By Stephen V. Chavez
4 MIN READ
blind and buried vias

Blind and buried vias: An HDI technology

March 13, 2025

One of the key innovations within HDI PCB design is the use of blind and buried vias, which enhance routing capabilities by freeing up additional routing resources, increasing the amount of routing channels while requiring fewer signal layers, and optimizing board space.

By Stephen V. Chavez
5 MIN READ