John McMillan
Sr. EDA Marketing Strategist

John has over 30 years in the EDA software industry. After many years as a Principal CAD Engineer performing PCB, hardware and MCAD design John has held various technical, marketing and R&D leadership roles in the EDA industry.

3d ic stacked chip

2.5D vs. 3D IC: which chip packaging technology is right for you?

June 24, 2025

Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional…

By John McMillan
6 MIN READ

​Why Traditional PCB Methods Fall Short in 3D IC Design

June 16, 2025

In this episode of the Siemens 3D IC Podcast Series,we delve into the world of FOWLP (Fan-out wafer-level packaging) with…

By John McMillan
11 MIN READ
3D IC rendering illustrating advanced chip packaging with vertically stacked dies

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

June 5, 2025

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip…

By John McMillan
6 MIN READ

​3D IC technology trends: Microarchitecture in IC design

June 3, 2025

In this latest Siemens EDA 3D IC podcast episode, we explore microarchitecture’s crucial role in 3D IC design. Listen in…

By John McMillan
11 MIN READ
Subscribe to the Siemens 3D IC podcast

🎧 Subscribe to the 3D IC podcast — your front row seat to the future of chip design

June 3, 2025

Listen now on your favorite platform: 🔹 Spotify🔹 Apple Podcasts🔹 Amazon Music🔹 YouTube Playlist 👉 Don’t forget to bookmark the…

By John McMillan
2 MIN READ

​3D IC technology trends: how advanced IC packaging is changing the semiconductor industry

May 21, 2025

The semiconductor industry is rapidly evolving with 3D IC technology and advanced packaging solutions revolutionizing chip design and manufacturing. In…

By John McMillan
7 MIN READ
Illustration of 3D IC stacked design

3D IC technology: your comprehensive guide to enabling heterogeneous integration

May 19, 2025

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

By John McMillan
14 MIN READ

Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

March 7, 2025

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and…

By John McMillan
3 MIN READ

3D IC design solutions: 2024 – Year in review

December 16, 2024

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

By John McMillan
3 MIN READ