The utilization of High Bandwidth Memory (HBM) has become a cornerstone for high performance computing (HPC) CPUs, GPUs, and AI…
The demand for increased power and performance in semiconductor packages has surged. As more die and chiplets are integrated into…
Designing advanced package layouts with large areas of metal can be a daunting task, given the stringent requirements imposed by…
The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package…
We have witnessed and learned about the industry’s significant shift in semiconductors. The traditional approach of transistor scaling, once universally…
Designs are just getting bigger and more complex Yes, an obvious aspect is increasing design complexity. Packages are now a…
The connectivity management complexity of package assemblies where multiple chiplets/ASICs and memory are heterogeneously integrated, introduces a great deal of…
The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…
If you’re designing a high-performance processor-based package, it’s common for the semiconductor package design to contain multiple logic chips that…
