What’s the fastest-growing area of semiconductor packaging?

HDAP! No longer reliant on the mobile market alone, High Density Advanced Packaging (HDAP) has become the fastest growing and most exciting new area of semiconductor packaging.

Emerging HDAP technologies, such as fan-out wafer-level packaging (FOWLP), System-in-Package (SIP), silicon interposers, Chip-on-Wafer-on-Silicon (CoWoS), and Wafer-on-Wafer (WoW) demand design tools that can keep up.

Mentor’s IC packaging solution does just that. Proven by fabless semis and foundries around the world, our integrated suite of technologies (Xpedition®, HyperLynx®, and Calibre®) is constantly evolving as well.

The latest release, VX.2.3, delivers a broad array of new capabilities, including proven sign-off integration with Calibre 3DSTACK and in-design package verification. Check out what’s new!

 

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/electronic-systems-design/2018/04/19/whats-the-fastest-growing-area-of-semiconductor-packaging/