Stop by the Mentor booth at ECTC’2017 and talk HDAP

By Keith Felton

If you’re planning to attend ECTC’2017 next week, then stop by the Mentor booth, #521, to talk with some of EDA’s foremost experts in High Density Advanced Packaging (HDAP) and multi-substrate co-design. Swap stories, ask tough questions, and find out why Mentor has the best flow for HDAP, from connectivity capture and prototyping through to detailed design, verification and sign off. Find out more about ECTC’2017 at

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This article first appeared on the Siemens Digital Industries Software blog at