IESF Automotive began 22 years ago and has been a must-attend event for automotive E/E design experts and executives throughout the world ever since. Over the years the event has maintained its focus on E/E system innovation. Once such example of this innovation can be found at STMicroelectronics.
As a leading supplier of automotive semiconductors, STMicroelectronics must continue to move fast to develop and deliver leading-edge solutions. Employing package design as part of system innovation requires the STMicroelectronics Back-End Manufacturing Technology R&D organization to embrace the key driving forces of product development. In the automotive field, package designers need to explore new methodologies and adopt a specific codesign flow for IC-package connectivity-data exchange (such as netlist tables) that is data robust and flexible. The STMicroelectronics Back-End Manufacturing Technology R&D team located in Agrate, Italy adopted Xpedition Substrate Integrator (xSI) from Siemens EDA, a part of Siemens Digital Industries Software, to help design activity meet these needs.
xSI allows system netlist construction and management for heterogeneous packages, aggregation of data from multiple sources in multiple formats, and visualization and interaction of all interconnect levels from a single environment. It provides hierarchical construction of the complete package assembly with step-by-step handling of multiple parts, including reuse of parts. Based on high-speed interface connectivity planning and optimization and multi-pitch bump-out evaluation, xSI provides:
- Flexibility for IC-package connectivity planning and optimization
- Efficient integration with external tools
- Fluid and fast on command response
- Very good technical support from the Siemens EDA team
To learn more about this implementation you can attend the following session at IESF on September 14th, 2022, at the Inn at St John’s in Plymouth, Michigan:
Heterogeneous Integration of Semiconductors for Autonomous Driving, Electric Vehicle, and ADAS Systems
Wednesday September 14, 3:00 pm – 3:30 EDT
Jamie Metcalfe, Market Development Manager
With the massive growth of electronics in the automotive sector (such as autonomous driving, electric vehicles, and safety systems), the complexity, capabilities, and volume of semiconductors is rapidly increasing the demand for greater package connectivity density. This has led to high-end IC-package solutions, such as copper pillar bumping with very fine pitches for flip chip applications. Furthermore, the move towards more in-package silicon integration using complex configurations, and the requirement to improve substrate stackup with an increasing number of metal layers to meet performance specifications, make configurations and system iterations much more complex. Within this context, the approach to design must include an in-depth assessment, starting with early-stage feasibility analysis, to investigate and predict early electrical performance in order to drive package development, selection, and technology. This paper will discuss a real-world early-stage design case study of an advanced drive-assistance system (ADAS) device where a system-level approach was deployed that incorporates die, package, and system PCB. Such an approach enables optimization of system connectivity and performance through the usage of co-design and co-simulation techniques.
Register now to attend this presentation and many more!