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Not yet a fan of fan-out? Why you should be!

Not yet a fan of fan-out? Why you should be!

By John Ferguson, Mentor Graphics FO-WLP combines multiple die from heterogeneous processes into a compact package, and that’s a good…

Interconnect Robustness Depends on Scaling for Reliability Analysis

Interconnect Robustness Depends on Scaling for Reliability Analysis

By Matthew Hogan, Mentor Graphics Fast simulation and PEX are both crucial to interconnect robustness verification. Can your tools scale…

Pattern Matching in Design Verification

Pattern Matching in Design Verification

By Michael White, Mentor Graphics Automated pattern matching can solve a wide range of design verification issues. Are you in…

Efficient Parasitic Extraction Techniques for Full-Chip Verification

Efficient Parasitic Extraction Techniques for Full-Chip Verification

By Yousry Elmaghraby, Mentor Graphics Choosing the best PEX method for your full-chip or SoC design is essential. But how…

How Do I ECO a Multi-Patterned Design?

How Do I ECO a Multi-Patterned Design?

By David Abercrombie and Alex Pearson, Mentor Graphics Applying ECOs to multi­patterned designs can be a nightmare, unless you plan…

Colorless vs. Colored Double-Patterning Design Flows

Colorless vs. Colored Double-Patterning Design Flows

By David Abercrombie, Mentor Graphics How do you know which double patterning flow to use?

Collaborative SoC Verification

Collaborative SoC Verification

By Matthew Hogan, Mentor Graphics The increasing use of SoC designs turns efficient IC design and validation into a team…

Reducing Post-Placement Leakage with Stress-Enhanced Fill Cells

Reducing Post-Placement Leakage with Stress-Enhanced Fill Cells

By Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan and Henrik Hovsepyan, Mentor Graphics Optimizing power usage for mobile devices at advanced…

When and How Should I Color My DP Layout?

When and How Should I Color My DP Layout?

By David Abercrombie, Mentor Graphics Automated DP coloring solutions minimize DP errors. But when is the best time and how…