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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Calibre IC Design & Manufacturing

Transistor-level EMIR analysis from custom design tools? It’s all about flexibility!

September 20, 2023
By Roger Kang How do you run transistor-level electromigration and voltage drop (EMIR) analysis—command line or an interactive invocation GUI?...
By Calibre IC Design & Manufacturing
2 MIN READ

Electronic Systems Design

PCB design best practices: FPGA/PCB co-design

September 20, 2023
The next best practice in the model-based systems engineering pillar is FPGA/PCB co-design and optimization. What is FPGA/PCB co-design? FPGA/PCB...
By Stephen V. Chavez
2 MIN READ

Semiconductor Packaging

What’s new in Xpedition IC Packaging VX.2.14

September 19, 2023
The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package...
By Keith Felton
2 MIN READ

Electronic Systems Design

What’s new in HyperLynx VX.2.14

September 19, 2023
The new VX.2.14 release of HyperLynx contains improvements across: HyperLynx DRC HyperLynx DRC includes a new via length rule that...
By Todd Westerhoff
< 1 MIN READ

Electronic Systems Design

What’s new in Xpedition VX.2.14

September 19, 2023
The new VX.2.14 release of Xpedition Enterprise includes improvements to design capture, multi-board systems design, library and design data management,...
By David Wiens
2 MIN READ

Electronic Systems Design

What's new in PADS Professional VX.2.14

September 19, 2023
PADS Professional is the best-in-class PCB design and analysis software for individuals and small workgroups. The PADS Professional desktop is...
By Jim Martens
< 1 MIN READ

Electronic Systems Design

How to Optimize PCB Design for the SMT Assembly Process Flow

September 19, 2023
PCB (Printed Circuit Board) design layout optimization is critical for the success of SMT (Surface Mount Technology) assembly. SMT assembly involves placing surface mount components directly onto the surface of the PCB, as opposed to through-hole components, which require holes to be drilled through the PCB. SMT assembly is faster, more precise, and more cost-effective than through-hole assembly, but it requires careful design optimization to ensure a successful assembly process.
By Don Kost
3 MIN READ

Calibre IC Design & Manufacturing

Save yourself the time—here’s a way for you to view native block instances from a full-chip context

September 14, 2023
By Ritu Walia Imagine this: You primarily work on the design of a sub-block of an application-specific layout design, or...
By Calibre IC Design & Manufacturing
< 1 MIN READ

Electronic Systems Design

Forging a new path: game-changing electro-thermal design advancement

September 13, 2023
Let’s talk about revolutionizing electro-thermal design. But first, some context. To meet the functional requirements of a circuit under design,...
By Matt Walsh
3 MIN READ

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