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BUGGED OUT PODCAST

Introducing BUGGED OUT — A new bite-sized podcast for verification engineers

BUGGED OUT Podcast

New RTL Modeling Constructs in Verilog

I’ve been packing up my office as Siemens is closing my location. This marks the longest I’ve ever spent in a single office, a whopping 15 years. Coincidentally, I was in the same building earlier with another company, Avant! for an additional 2 years. I’ve got a box of stuff from previous jobs that I rarely unpack. But it happened to go through it and found the proceedings from what was to become the first DVCon in 1992. I doubt these proceedings exist anywhere in digital form.

In the proceedings was a paper I published about a new RTL modeling construct I added to Verilog before it became an IEEE standard. It eventually became known as a NonBlocking Assignment (NBA).

Interchange format standard in hierarchical CDC and RDC analysis

For large designs with numerous asynchronous clocks and resets, there is a growing need to do clock domain crossing (CDC) and reset domain crossing (RDC) analysis in a hierarchical way. This allows parallelization of sub-block and noiseless analysis and helps reduce SoC runtime and speed closure of CDC and RDC issues at the SoC level. Conversely, it poses challenges for design houses using third-party IP in ensuring the compatibility of their hierarchical data models (HDM) in the case of multiple EDA tools usage.

From manageability to 3.0: Unlocking the future with UCIe verification

The semiconductor industry is steadily moving toward multi-die integration, where chiplets from different sources are combined within a single package (known as a system in package or SiP) to deliver higher performance, scalability, and efficiency. The Universal Chiplet Interconnect Express (UCIe) standard is the backbone of this movement, offering a high-bandwidth, low-latency interconnect that enables heterogeneous chiplets to operate as one system.

UCIe 3.0 raises the bar once again. By adding higher data rates, runtime recalibration, priority sideband messaging, low-power sideband operation, and circular buffer transport, the standard improves both performance and efficiency. But it also increases verification complexity.

Pushing boundaries: Smarter verification for UCIe multi-die systems

The semiconductor industry is at a turning point. As demand for higher performance and energy efficiency continues to grow, chipmakers…

From Novice to Expert: Your Tutorial Roadmap at DVCon Europe 2025

In support of Verification Academy’s educational mission, Siemens is either directly sponsoring or contributing to the following five tutorials at…

Class is back in session this October: Verification Academy’s cutting-edge weekly webinar series

Verification Academy’s fall semester starts this October with the following series of weekly deep dive webinars. Abstracts and registration links…

No Reset? No Worries! Smarter Ways to Tackle RDCs to NRRs

As system-on-chip (SoC) designs continue to evolve, they’re not just expanding in size—they’re growing in complexity. Among the many challenges…

Functional Verification Insights with Abhi Kolpekwar

Functional verification insights: a conversation with Abhi Kolpekwar

Over the years, I’ve had the privilege of sharing industry data and analysis through the Siemens EDA & Wilson Research Group…