Custom IC

Filter by:

Featured posts

EDA AI panel at the 2025 Siemens EDA User2User conference in Santa Clara, CA. Panelists (from left to right): Ting Ku (Nvidia), Ken Dyer (Microsoft), Karan Singh (AWS), Andrew Ross (AMD), Dan Yu (Siemens EDA), and Jeff Dyck (Siemens EDA).

Blueprint for Achieving Excellence in EDA using AI: Industry Experts Weigh In

June 10, 2025

This engaging Siemens EDA panel on AI implementation highlighted several key points: AI will enhance human expertise in EDA; while rich EDA data is crucial, it also poses challenges; robust compute infrastructure is essential for AI-driven EDA systems; and the adoption of AI should be swift yet stable

By Niranjan Sitapure, PhD.
3 MIN READ

Latest posts

Meet the Solido Custom IC Team at DAC 2025

June 16, 2025

The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover…

By Emma-Jane Crozier
3 MIN READ
EDA AI panel at the 2025 Siemens EDA User2User conference in Santa Clara, CA. Panelists (from left to right): Ting Ku (Nvidia), Ken Dyer (Microsoft), Karan Singh (AWS), Andrew Ross (AMD), Dan Yu (Siemens EDA), and Jeff Dyck (Siemens EDA).

Blueprint for Achieving Excellence in EDA using AI: Industry Experts Weigh In

June 10, 2025

This engaging Siemens EDA panel on AI implementation highlighted several key points: AI will enhance human expertise in EDA; while rich EDA data is crucial, it also poses challenges; robust compute infrastructure is essential for AI-driven EDA systems; and the adoption of AI should be swift yet stable

By Niranjan Sitapure, PhD.
3 MIN READ

Solido Custom IC Innovation at Intel Foundry Direct Connect 2025

June 10, 2025

The Solido Custom IC team, alongside colleagues from across Siemens EDA, joined ecosystem partners at Intel Foundry Direct Connect 2025…

By siddharth ravikumar
2 MIN READ

Heading to DAC 2025 with Thine: Advanced Verification Solutions for ICs to Ensure High Quality Amid PVT Variations

June 5, 2025

At the center of modern communication systems lies a critical component: the phase interpolator (PI). This relatively tiny component plays…

By Lih-Jen Hou
2 MIN READ

Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

May 13, 2025

After an extensive qualification process, Analog FastSPICE (AFS), part of Solido™ Simulation Suite, has achieved certification for TSMC’s N2P and…

By Emma-Jane Crozier
2 MIN READ

Heading to DAC 2025 with Microsoft: Novel TRNG Verification with a High-Performance Simulation Methodology

April 15, 2025

In our data-driven world, the need for robust security solutions continues to grow. At the heart of modern cryptographic systems…

By Lih-Jen Hou
2 MIN READ

Reflections from Siemens EDA User2User Forum in Noida

April 2, 2025

I recently had the privilege of representing the Solido Custom IC (CIC) team at the Siemens EDA User2User Forum 2025…

By Neel Natekar
3 MIN READ

Achieving Automotive Functional Safety Compliance with ISO 26262 Certified Solido Custom IC Solutions

March 31, 2025

As the automotive industry rapidly evolves, with the rise of autonomous driving, electrification, and advanced driver-assistance systems (ADAS), the need…

By Saurabh Kulkarni
2 MIN READ
The Crucial Role of Full-Spectrum Transient Noise Analysis for Silicon Success

The Crucial Role of Full-Spectrum Transient Noise Analysis for Silicon Success

March 5, 2025

As chips continue to push the boundaries of performance, ensuring first time silicon success has never been more critical. For…

By Scott Guyton
2 MIN READ