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Agentic IC design panel discussion at Solido Custom IC Forum

Is Agentic IC Design the Next Big Thing? Industry Experts Answer

Industry leaders reveal how agentic IC design is transforming chip development. Discover adoption trends, benefits & challenges.

Mixed-Signal Verification: Symphony Customer Success Stories across the Siemens EDA and Solido Custom IC Forums

Three countries. Multiple customer presentations and posters. One clear takeaway: Siemens’ Symphony, part of Solido Simulation Suite, is solving the…

Creating Cohesive High-Speed Link Verification through Solido SPICE IBIS-AMI Support

We are now firmly in the AI era! As artificial intelligence penetrates every aspect of our daily lives, its impact…

Driving the Future of Custom IC Design with AI: Highlights from Siemens EDA Forum Taiwan 

The Siemens EDA Forum in Taiwan brought together a packed audience and an impressive showcase of booths from across the…

Solido Custom IC at GTS 2025

Solido Custom IC at GTS 2025

The semiconductor industry is an ever-accelerating race, pushing the boundaries of what’s possible with each new process node. On August…

Accelerating Digital Design: New Library Generation and Analysis Flows from Google-Siemens EDA Collaboration at DAC

From rapid library generation to precise analytics, Google and Siemens EDA’s latest collaboration presented at DAC tackles some of the biggest challenges in mobile SoC development.

Forging the Future of Library Verification with AI-Powered Custom IC Design and Verification Solutions

Discover how the powerful collaboration between Samsung Foundry and Siemens EDA has resulted in a groundbreaking methodology to speed up standard cell library verification by 14X over conventional approaches.

Meet the Solido Custom IC Team at DAC 2025

The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover our innovative AI solutions that are transforming the custom IC landscape.

EDA AI panel at the 2025 Siemens EDA User2User conference in Santa Clara, CA. Panelists (from left to right): Ting Ku (Nvidia), Ken Dyer (Microsoft), Karan Singh (AWS), Andrew Ross (AMD), Dan Yu (Siemens EDA), and Jeff Dyck (Siemens EDA).

Blueprint for Achieving Excellence in EDA using AI: Industry Experts Weigh In

This engaging Siemens EDA panel on AI implementation highlighted several key points: AI will enhance human expertise in EDA; while rich EDA data is crucial, it also poses challenges; robust compute infrastructure is essential for AI-driven EDA systems; and the adoption of AI should be swift yet stable