Latest posts

Next-generation RF, ESD and IO designs on display at TSMC 2023 OIP Ecosystem Forum

TSMC 2023 Open Innovation Platform® Ecosystem Forum is taking a world stage in North America, Europe, Taiwan, China, Israel and…

How AI-powered EDA solutions help design and verify library IP for SoCs

Note: If you’re interested in knowing more about the Solido Library IP Solution, check out our on-demand webinar about optimizing…

Discussing Custom IC Verification with Taiwan Semiconductor Community

Taiwan is an inspiration to many countries that aspire to build or expand their semiconductor ecosystem. Although a small nation,…

Mixed Reality needs Mixed Signal

Mixed Reality needs Mixed Signal

Empowering the Design and Verification of Mixed-Signal SoCs for Advanced Spatial Computing with Symphony Pro We are on the cusp…

World tour of CICV solutions continues to build semiconductor partnerships

Disruptions create difficult challenges, but it provides inspiration to create new solutions. Partnerships further accelerate the process by instilling confidence…

IP Validation @ U2U EU

Siemens EDAs user-to-user (U2U) Europe conference will take place in Munich, Germany on May 11th.  If you have not already…

Analog Computing: The Underdog AI Hero That Refuses to Go Digital

Generative AI has the potential to benefit humankind in various ways. It can assist creative industries by generating innovative works…

Don’t Skip Steps: The Significance of Qualifying IP Revisions

Have you ever written a Master’s thesis, a paper for a science class, or even an article for a school…

Migrating to the cloud for intelligent SoC verification 

Are you tired of dealing with limited on-premises compute resources and competing for compute resources to launch your critical design…