Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Semiconductor Packaging

Streamlining AI device design using AI and Innovator3D IC Integrator

Two such STCO-related activities are now AI-powered in Innovator3D IC Integrator as part of the 2604 release and deliver superior results in an efficient predictable manner.

By Keith Felton

Electronic Systems Design

What's new in Valor 2604

The latest release of Valor NPI 2604 continues to strengthen our Design-For-Manufacturing (DFM) validation by bringing new constraint types, additional checks and enhanced analysis capabilities.

By Patrick Hope

Electronic Systems Design

What's new in Xpedition 2604

The Xpedition 2604 release brings a host of enhancements designed to streamline your workflow, improve collaboration, and ensure design integrity from concept to manufacturing.

Electronic Systems Design

What's new in HyperLynx 2604

HyperLynx 2604 release brings a comprehensive set of enhancements that make PCB design verification faster, more intelligent, and more accessible

By Sajeda Tamimi

Semiconductor Packaging

What's new in Innovator3D IC 2604

This latest Innovator3D IC release brings a raft of design capability and productivity enhancements to the product family, further enabling its ability to design for the latest AI and Hyperscaler devices using advanced heterogeneous integration platforms.

By Keith Felton

Semiconductor Packaging

HBM3e and HBM4: IC design guide for next-generation high bandwidth memory

HBM3e (High Bandwidth Memory) is the current production-grade high bandwidth memory architecture, delivering over 1.2 TB/s per stack and powering the AI...

Solido and AI-powered EDA: TSMC certification, reference flow, and what it all means for advanced node design

Solido's AI-powered EDA tools have earned TSMC certification and a place in the reference flow for A14. Here's what that means for designers working at advanced process nodes.

By Emma-Jane Crozier

Calibre IC Design & Manufacturing

Tackling compute complexity in ESD verification with Calibre

Explore how Calibre PERC and Calibre 3DPERC tackle the escalating compute complexity of ESD verification in advanced IC designs, including 2.5D and 3DIC structures, ensuring robust protection and signoff-quality results

By Calibre IC Design & Manufacturing

What to expect at the Solido Custom IC track at User2User North America 2026

Intel, NVIDIA, Microsoft, and STMicroelectronics will be sharing their real-world experiences using AI-powered Solido tools for custom IC design.

By Emma-Jane Crozier