Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Electronic Systems Design

AA battery replacement project tutorial #2: USB-C

October 09, 2026

Part 2 of the AA battery replacement project created by Shrouk.

By Shrouk El-Attar

Electronic Systems Design

Beyond the AA Battery: Follow Shrouk’s USB-C Replacement Project with Xpedition Standard Free for 60 Days

October 09, 2026

Think of this blog as your Getting Started Guide … because it is your getting started guide 😊 What if...

Electronic Systems Design

AA battery replacement project tutorial #1: PartQuest main parts

October 09, 2026

Read Shrouk's first tutorial for her AA battery replacement project and follow along with Xpedition Standard.

By Shrouk El-Attar

Cre8Ventures (Siemens EDA)

From Technology to Mission: Siemens Cre8Ventures Enters Its Next Phase

October 08, 2026

Bringing robotics, digital twins and Europe’s emerging semiconductor, quantum and photonics ecosystem together around real-world industrial missions Europe has no...

By Carson Bradbury

Solido Layout Analyzer: AI-powered post-layout analysis

October 07, 2026

Eliminate post-layout bottlenecks. Solido Layout Analyzer uses AI to connect parasitics and layout-dependent effects directly to circuit performance.

By Mohamed Atoua, Emma-Jane Crozier

Stop tracing nets by hand, start seeing them

October 06, 2026

Stop tracing nets by hand. Discover how S-Edit and L-Edit reveal full net connectivity across schematics and layouts without waiting on extraction.

Inside Bengaluru’s semiconductor hub: Key highlights from the Solido Custom IC Forum 2026

October 05, 2026

Highlights from Solido Custom IC Forum 2026: AI-powered innovations, agentic EDA workflows and frontline custom chip design and verification

By Mamoona Ahmad

Semiconductor Packaging

Scaling 3D IC design: Trends, challenges and practical workflows

October 05, 2026

Part 1: The reticle limit, advanced packaging and the multiphysics challenge Authors: Kevin Rinebold and Andras Vass-Varnai, Ph.D. This blog...

By John McMillan

Calibre IC Design & Manufacturing

Solving the extraction challenges of CFET and backside power

September 30, 2026

By Karen Chow, Sheetal Veronica, and Kunjesh Agashiwala Introduction: The vertical evolution of semiconductor architecture Both complementary field-effect transistor (CFET)...