Log in
Skip to content

Main Navigation

Blogs
  • Products
    • All Products
    • Additive Manufacturing Software
    • Aprisa
    • Calibre IC Design & Manufacturing
    • Capital
    • Catchbook
    • Custom IC
    • Designcenter
    • Digital Logistics
    • EDA Consulting Services
    • Electronic Systems Design
    • Fibersim
    • Hardware Assisted Verification
    • HLS Design & Verification Blog
    • HPCWorks
    • Insights Hub
    • JT
    • Mendix
    • NX Design
    • NX Manufacturing
    • Opcenter
    • Pave360
    • PLM Components
    • Polarion
    • Questa
    • Rapidminer
    • Semiconductor Packaging
    • Service Lifecycle Management
    • Simcenter
    • Solid Edge
    • Teamcenter
    • Teamcenter Manufacturing
    • Tecnomatix
    • Tessent Solutions
    • Valor
  • Industries
    • All Industries
    • Aerospace & Defense
    • Automotive & Transportation
    • Consumer Products & Retail
    • Electronics & Semiconductors
    • Energy & Utilities
    • Heavy Equipment
    • Industrial Machinery
    • Marine
    • Medical Devices & Pharmaceuticals
  • Podcasts
    • All Podcasts
    • 3D IC
    • Additive Manufacturing Podcast
    • AI Spectrum
    • Bugged Out
    • Cloud Talk Today
    • Digital Powers Flexible: Consumer Products Podcast
    • Digital Transformation Podcast
    • Empowering Engineering Educators
    • Energy Transformation Podcast
    • Engineer Innovation Podcast
    • Engineering the Future Workforce
    • Model Based Matters
    • Next Generation Design Podcast
    • On the Move: A Siemens Automotive Podcast
    • Pioneers: Startups from Dreams to Reality
    • Printed Circuit Podcast
    • Security by Design
    • Talking Aerospace Today Podcast
    • The Battery Podcast
    • The Digital Dig - A Siemens Heavy Equipment Podcast
    • The Industry Forward Podcast
    • The Marine Industry Podcast Series
    • The Voice of Smart Digital Manufacturing Podcast
    • Where Today Meets Tomorrow Podcast
    • German only Podcasts
    • Machinenbau Talk
  • Thought Leadership
    • All Thought Leadership
    • Digital Transformation
    • Embedded Software
    • Expert Insights
    • Simulating the Real World
    • The Art of the Possible
    • Thought Leadership
    • Verification Horizons
  • Corporate
    • All Corporate
    • Academic and Future Workforce
    • AWS Partnership
    • Corporate Blog
    • Cre8Ventures (Siemens EDA)
    • EDA Support Blogs
    • Employee Spotlight
    • eXplore tour
    • Partners
    • Realize LIVE
    • Siemens Xcelerator Academy
    • Siemens Xcelerator Software for Industry
    • Small & Medium Business
    • Xcelerator for Startups Videos
  • Community
  1. Home

Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

  • Aprisa
  • Calibre
  • EDA Consulting Services
  • HyperLynx
  • Innovator3D IC
  • PADS
  • PartQuest
  • PAVE360
  • ProFPGA
  • Questa
  • Solido
  • Tessent
  • Valor DFM
  • Veloce
  • Xpedition

Semiconductor Packaging

HBM3e and HBM4: IC design guide for next-generation high bandwidth memory 

April 24, 2026
HBM3e (High Bandwidth Memory) is the current production-grade high bandwidth memory architecture, delivering over 1.2 TB/s per stack and powering the AI...
By Emily Yan
8 MIN READ

Custom IC

Solido and AI-powered EDA: TSMC certification, reference flow, and what it all means for advanced node design

April 23, 2026
Solido's AI-powered EDA tools have earned TSMC certification and a place in the reference flow for A14. Here's what that means for designers working at advanced process nodes.
By Emma-Jane Crozier
3 MIN READ

Calibre IC Design & Manufacturing

Tackling compute complexity in ESD verification with Calibre

April 23, 2026
Explore how Calibre PERC and Calibre 3DPERC tackle the escalating compute complexity of ESD verification in advanced IC designs, including 2.5D and 3DIC structures, ensuring robust protection and signoff-quality results
By Calibre IC Design & Manufacturing
6 MIN READ

Custom IC

What to expect at the Solido Custom IC track at User2User North America 2026

April 22, 2026
Intel, NVIDIA, Microsoft, and STMicroelectronics will be sharing their real-world experiences using AI-powered Solido tools for custom IC design.
By Emma-Jane Crozier
2 MIN READ

Electronic Systems Design

From classroom to General Motors: How a Siemens sponsored PCB course helped one student see the bigger picture 

April 14, 2026
Learn about Maggie’s experience using Siemens PCB design software in a course sponsored by Siemens alongside PCEA, with instruction support from Steph Chavez and Wayne State faculty. 
By Arlina Yang
5 MIN READ

Semiconductor Packaging

Streamlining 3D IC design with multiphysics

April 14, 2026
As 3D IC systems continue to scale in complexity, multiphysics is no longer a specialized late-stage activity. It is becoming a core requirement for building designs that can be manufactured successfully and meet long-term performance and lifetime targets.
By Keith Felton
2 MIN READ

Calibre IC Design & Manufacturing

Why a GPU rasterizer matters for computational lithography in both performance and precision at scale

April 13, 2026
This technical analysis explores GPU rasterizer for accelerated mask synthesis. Benchmarks show 290x speedup for Manhattan geometries and 45x for curvilinear shapes with <1% error.
By Calibre IC Design & Manufacturing
6 MIN READ

Electronic Systems Design

How constraint-driven design boosts quality and reliability

April 08, 2026
Constraint-driven design helps engineering teams move from reactive PCB design to a proactive, intelligent workflow. Xpedition Standard helps growing teams implement a more disciplined PCB design process without forcing unnecessary complexity.
By David Haboud
6 MIN READ

Calibre IC Design & Manufacturing

Meeting the challenges of reliability verification for the era of 3D ICs

April 01, 2026
Advanced reliability verification for 2.5D/3D ICs with Innovator3D IC and Calibre 3DPERC. Ensure robust reliability and accelerate sign-off.
By Calibre IC Design & Manufacturing
4 MIN READ

Posts navigation

  • 1
  • 2
  • 3
  • …
  • 201
  • »