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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Electronic Systems Design

DDR and AMS Simulation in the PADS Professional Premium flow

March 21, 2023
Analysis at every step of the design process has become essential in producing quality boards with less rerun time and...
By Shivani Joshi
3 MIN READ

Electronic Systems Design

How to answer five common questions about power module current density

March 21, 2023
Power module current density is an important factor in determining the efficiency and performance of power modules. It can vary...
By wilfriedwessel
3 MIN READ

Aprisa

Join us at the Aprisa Digital IC Implementation track during the 2023 User2User symposium

March 20, 2023
Learn about Aprisa Digital IC Implementation from real users at the 2023 User2User symposium.
By Aprisa Team
3 MIN READ

Electronic Systems Design

PCB design best practices: concurrent design

March 17, 2023
The second PCB design best practice that falls into the engineering productivity and efficiency pillar is concurrent design. What is...
By Stephen Chavez
4 MIN READ

AMS Verification

Migrating to the cloud for intelligent SoC verification 

March 16, 2023
Are you tired of dealing with limited on-premises compute resources and competing for compute resources to launch your critical design...
By Nebabie Kebebew
2 MIN READ

Tessent Solutions

Event: Tessent 2023 DFT Tech Forum

March 15, 2023
Attend the 2023 DFT Tech Forum to learn how Tessent silicon lifecycle solutions solve your complex SoC DFT challenges.
By Tessent Solutions
2 MIN READ

AMS Verification

EDA innovation at its finest display in the Pacific Rim

March 15, 2023
In continuation to my earlier blog on Semiconductor renaissance in the making, it is essential that foundries, IC design and...
By Pradeep Thiagarajan
3 MIN READ

Electronic Systems Design

What’s new in PADS Professional release VX.2.13

March 15, 2023
The new VX.2.13 release of PADS Professional has improvements for the following features in PADS Professional layout. Enhancements to the...
By Jim Martens
2 MIN READ

Semiconductor Packaging

What’s new in Xpedition IC Packaging release VX.2.13

March 15, 2023
The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which...
By Keith Felton
2 MIN READ

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