Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

From complexity to clarity: Simplifying AMS verification with Mixed-Signal Visualizer

August 12, 2026

Siemens EDA's Mixed-Signal Visualizer simplifies AMS verification by tackling the debug bottleneck with intuitive, holistic views.

By Neel Natekar, luong nguyen

Electronic Systems Design

The BOM Is no longer documentation, it's engineering intelligence

August 06, 2026

The Bill of Materials deserves to be viewed differently. It is no longer simply documentation created after engineering decisions have been made. It is one of the earliest indicators of product resilience and one of the richest sources of engineering intelligence available to the development team.

By Stephen V. Chavez

Electronic Systems Design

From optimization to AI: The evolution of intelligent PCB analysis

August 06, 2026

PCB designers face a difficult reality: every generation of electronics demands more performance, tighter margins, and shorter development schedules. High-speed...

By bradleycecil

Calibre IC Design & Manufacturing

DRC at scale: How Calibre Vision AI turns billions of errors into actionable insights

August 05, 2026

Accelerate DRC closure for advanced node SoCs with Calibre Vision AI. Real-time, AI-guided analysis shortens debug cycles and enables efficient team collaboration for faster, predictable physical verification.

By Calibre IC Design & Manufacturing

Electronic Systems Design

How to choose the best chainsaw to cut a loaf of bread?

August 05, 2026

Here is the truth that you need to hear: In PCB simulation, overkill is the ultimate bottleneck. You think that running a 3D solver on your board should close the inaccuracy gap, while, in reality, it opens a productivity gap.

By Sajeda Tamimi

EDA Support Blogs

Abracadabra – using Tessent magic to repair non-repairable memories

August 04, 2026

The cost for silicon at smaller modern technology nodes is inflationary to say the least. Therefore, yield, cannot just be...

By Lincoln McLoud

Electronic Systems Design

Single Event Effects (SEE) in Rad-Hard components with HyperLynx AMS

What makes SEEs particularly challenging is that they can't be stopped by traditional physical shielding, making Radiation-Hardened (Rad-Hard) components essential for systems operating in harsh environments like space or military applications.

By Sajeda Tamimi

Electronic Systems Design

Engineering concurrency: The future of collaborative PCB design

For decades, electronic product development followed a familiar sequence. System architects defined requirements, electrical engineers developed schematics, PCB designers created...

By Stephen V. Chavez

Cre8Ventures (Siemens EDA)

From Physical Reality to Engineering Intelligence

Siemens Cre8Ventures and Solaya collaborate to accelerate Europe’s next generation of Physical AI and Digital Twins. The future of industrial...

By Carson Bradbury