Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Blueprint for Achieving Excellence in EDA using AI: Industry Experts Weigh In

This engaging Siemens EDA panel on AI implementation highlighted several key points: AI will enhance human expertise in EDA; while rich EDA data is crucial, it also poses challenges; robust compute infrastructure is essential for AI-driven EDA systems; and the adoption of AI should be swift yet stable

By Niranjan Sitapure, PhD.

Solido Custom IC Innovation at Intel Foundry Direct Connect 2025

The Solido Custom IC team, alongside colleagues from across Siemens EDA, joined ecosystem partners at Intel Foundry Direct Connect 2025...

By siddharth ravikumar

Design with Calibre

Enhancing EUV lithography resolution at high numerical aperture

By Ethan Maguire As the semiconductor industry continues to push the boundaries of feature size and density, the need for...

By Design With Calibre

Electronic Systems Design

Bending the rules: How to design smarter with rigid-flex PCBs

In a season three of the Printed Circuit Podcast, host Steph Chavez welcomed industry expert Tara Dunn, Director of Training...

Heading to DAC 2025 with Thine: Advanced Verification Solutions for ICs to Ensure High Quality Amid PVT Variations

At the center of modern communication systems lies a critical component: the phase interpolator (PI). This relatively tiny component plays...

Semiconductor Packaging

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip...

By John McMillan

Semiconductor Packaging

3D IC technology trends: Microarchitecture in IC design

In this latest Siemens EDA 3D IC podcast episode, we explore microarchitecture’s crucial role in 3D IC design. Listen in...

By John McMillan

Electronic Systems Design

Leveraging market-ready PCB design solutions for efficient design phases - Part 1: Understanding the time-to-market advantage

What if your design team could cut development time in half while improving product quality? In today's fast-paced electronics industry, the ability to optimize time-to-market isn't just convenient—it's essential for survival and success.

By David Haboud

Semiconductor Packaging

🎧 Subscribe to the 3D IC podcast — your front row seat to the future of chip design

Listen now on your favorite platform: 🔹 Spotify🔹 Apple Podcasts🔹 Amazon Music🔹 YouTube Playlist 👉 Don’t forget to bookmark the...

By John McMillan