Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Library characterization takes too long – here's how Solido Characterizer uses AI to change that

Tired of library characterization taking weeks? Solido Characterizer uses AI to slash runtime to days, boosting throughput by 7x with predictive, generative and agentic AI.

By Emma-Jane Crozier

EDA Consulting Services

When Dummies Turn Smart: The Evolution of Dummy Fill in Advanced Semiconductor Manufacturing

Yield stands as a critical performance indicator in semiconductor fabrication. Higher yield rates reflect optimized manufacturing processes that produce functional chips,...

By Consulting Services

Introducing Custom IC Design Tool Tips: a new YouTube series for S-Edit and L-Edit users

The CICD team has launched Tool Tips! A YouTube series of short, practical walkthroughs for engineers working with S-Edit and L-Edit.

By Mamoona Ahmad

Cre8Ventures (Siemens EDA)

Athena P3M Joins the Siemens Cre8Ventures Digital Twin Marketplace

Siemens Cre8Ventures is pleased to welcome Athena P3M to the Siemens Cre8Ventures Digital Twin Marketplace. Athena P3M is a specialist...

By Carson Bradbury

How NVIDIA is scaling Liberty verification for diverse IP using the Solido Characterization Suite

NVIDIA scales Liberty verification for diverse IP using Solido Characterization Suite, tackling challenges like diverse IP, consistency, and scalability for improved silicon quality.

By siddharth ravikumar

Electronic Systems Design

How HyperLynx AMS and PartQuest Explore unlock FMI co-simulation

his blog highlights the integration of Functional Mockup Interface (FMI) co-simulation capabilities into Siemens' HyperLynx AMS and PartQuest Explore simulation tools.

By Sajeda Tamimi

Chiplet Summit 2026: Solido Simulation Suite tackles the verification complexities of 3D IC design

Solido Simulation Suite excels at Chiplet Summit 2026, tackling 3D IC verification complexities with SPICE-level accuracy for chiplet workflows.

Electronic Systems Design

Unleash the power of DDR5 & LPDDR5 parallel simulations

With the release of HyperLynx 2604, Siemens EDA is empowering engineers to do just that, thanks to the new DDRx Batch Wizard Parallelization Support.

By Sajeda Tamimi

Semiconductor Packaging

Streamlining 3D IC design interface performance

If you are planning to design a high-performance multi-chiplet heterogeneously integrated package, then you know that to achieve design performance, the integration between the logic chiplets is key.

By Keith Felton