Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

What to expect at the Solido Custom IC track at User2User North America 2026

Intel, NVIDIA, Microsoft, and STMicroelectronics will be sharing their real-world experiences using AI-powered Solido tools for custom IC design.

By Emma-Jane Crozier

Electronic Systems Design

From classroom to General Motors: How a Siemens sponsored PCB course helped one student see the bigger picture

Learn about Maggie’s experience using Siemens PCB design software in a course sponsored by Siemens alongside PCEA, with instruction support from Steph Chavez and Wayne State faculty.

Semiconductor Packaging

Streamlining 3D IC design with multiphysics

As 3D IC systems continue to scale in complexity, multiphysics is no longer a specialized late-stage activity. It is becoming a core requirement for building designs that can be manufactured successfully and meet long-term performance and lifetime targets.

By Keith Felton

Calibre IC Design & Manufacturing

Why a GPU rasterizer matters for computational lithography in both performance and precision at scale

This technical analysis explores GPU rasterizer for accelerated mask synthesis. Benchmarks show 290x speedup for Manhattan geometries and 45x for curvilinear shapes with <1% error.

By Calibre IC Design & Manufacturing

Electronic Systems Design

How constraint-driven design boosts quality and reliability

Constraint-driven design helps engineering teams move from reactive PCB design to a proactive, intelligent workflow. Xpedition Standard helps growing teams implement a more disciplined PCB design process without forcing unnecessary complexity.

By David Haboud

Calibre IC Design & Manufacturing

Meeting the challenges of reliability verification for the era of 3D ICs

Advanced reliability verification for 2.5D/3D ICs with Innovator3D IC and Calibre 3DPERC. Ensure robust reliability and accelerate sign-off.

By Calibre IC Design & Manufacturing

Electronic Systems Design

Improving functional safety analysis

In safety-critical applications, engineers must perform functional safety analysis to ensure that their designs meet or exceed safety standards.

By Daniel Zhang

EDA Support Blogs

ECC in Memory Test and Repair

Error Correction Codes (ECC) have long been a cornerstone of reliable memory design, primarily serving as a shield against transient...

By Jack Zhamkochyan

Tessent Solutions

Detect, diagnose, and debug using sensors and functional monitoring

Discover how a Tessent functional monitoring solution, working in conjunction with Movellus Inc. Aeonic Insight™ Droop Detector IP for Power Delivery Network (PDN) telemetry, can provide a multi-instrument monitoring solution that detects a voltage anomaly, and cross-triggers functional monitoring that enables engineers to diagnose issues. This combined approach provides enhanced visibility and insight, as part of Silicon Lifecycle Management and delivers a more sophisticated approach to monitoring, in order to detect and perform root-cause analysis in-life.

By Tessent Solutions