Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Calibre IC Design & Manufacturing

The Calibre 3D IC solution: Mastering the complexities of advanced 3D IC chip design

Optimize 3D IC chip design from concept to sign-off with Calibre 3D IC solutions. Achieve accurate electro-thermo-mechanical co-simulation, prevent costly errors, and accelerate time-to-market.

By Calibre IC Design & Manufacturing

Semiconductor Packaging

Streamlining power integrity analysis for 3D IC designs

The rules of semiconductor scaling have changed. With traditional transistor scaling slowing, advanced packaging has emerged as the primary driver...

By Sudarshan Deo, Muhammad Hassan

Microchip’s journey to accelerated verification with Solido Additive Learning

Microchip leverages Solido Additive Learning's AI-driven approach to accelerate iterative variation-aware verification by 3x to 20x, reducing re-verification cycles from weeks to hours.

By Jayne Alexander

Accelerating design innovation through scalable computing with cloud-ready Solido Simulation Suite on Amazon Web Services

Solido Simulation Suite on Amazon Web Services offers a cloud-ready solution to tackle the growing complexity of chip design by providing scalable, on-demand compute resources for efficient circuit simulation.

By Saurabh Kulkarni

Electronic Systems Design

From manual effort to engineering intelligence: Driving PCB design productivity through automation and abstraction

For decades, PCB design productivity has been measured the wrong way. Productivity is no longer about how much work engineers can perform—it’s about how effectively that work is systematized, reused, and enforced by design.

By Stephen V. Chavez

Hardware Assisted Verification

The million-dollar bug: Why hyperscale verification can't afford delays

The Hyperscale Verification Challenge In my early days as a verification engineer, the Vice-President of the division walked into my...

By benwhitehead

Semiconductor Packaging

Streamlining AI device design using AI and Innovator3D IC Integrator

Two such STCO-related activities are now AI-powered in Innovator3D IC Integrator as part of the 2604 release and deliver superior results in an efficient predictable manner.

By Keith Felton

Electronic Systems Design

What's new in Valor 2604

The latest release of Valor NPI 2604 continues to strengthen our Design-For-Manufacturing (DFM) validation by bringing new constraint types, additional checks and enhanced analysis capabilities.

By Patrick Hope

Electronic Systems Design

What's new in Xpedition 2604

The Xpedition 2604 release brings a host of enhancements designed to streamline your workflow, improve collaboration, and ensure design integrity from concept to manufacturing.