Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Electronic Systems Design

From manual effort to engineering intelligence: Driving PCB design productivity through automation and abstraction

For decades, PCB design productivity has been measured the wrong way. Productivity is no longer about how much work engineers can perform—it’s about how effectively that work is systematized, reused, and enforced by design.

By Stephen V. Chavez

Hardware Assisted Verification

The million-dollar bug: Why hyperscale verification can't afford delays

The Hyperscale Verification Challenge In my early days as a verification engineer, the Vice-President of the division walked into my...

By benwhitehead

Semiconductor Packaging

Streamlining AI device design using AI and Innovator3D IC Integrator

Two such STCO-related activities are now AI-powered in Innovator3D IC Integrator as part of the 2604 release and deliver superior results in an efficient predictable manner.

By Keith Felton

Electronic Systems Design

What's new in Valor 2604

The latest release of Valor NPI 2604 continues to strengthen our Design-For-Manufacturing (DFM) validation by bringing new constraint types, additional checks and enhanced analysis capabilities.

By Patrick Hope

Electronic Systems Design

What's new in Xpedition 2604

The Xpedition 2604 release brings a host of enhancements designed to streamline your workflow, improve collaboration, and ensure design integrity from concept to manufacturing.

Electronic Systems Design

What's new in HyperLynx 2604

HyperLynx 2604 release brings a comprehensive set of enhancements that make PCB design verification faster, more intelligent, and more accessible

By Sajeda Tamimi

Semiconductor Packaging

What's new in Innovator3D IC 2604

This latest Innovator3D IC release brings a raft of design capability and productivity enhancements to the product family, further enabling its ability to design for the latest AI and Hyperscaler devices using advanced heterogeneous integration platforms.

By Keith Felton

Semiconductor Packaging

HBM3e and HBM4: IC design guide for next-generation high bandwidth memory

HBM3e (High Bandwidth Memory) is the current production-grade high bandwidth memory architecture, delivering over 1.2 TB/s per stack and powering the AI...

Solido and AI-powered EDA: TSMC certification, reference flow, and what it all means for advanced node design

Solido's AI-powered EDA tools have earned TSMC certification and a place in the reference flow for A14. Here's what that means for designers working at advanced process nodes.

By Emma-Jane Crozier