Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Semiconductor Packaging

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip...

By John McMillan

Semiconductor Packaging

3D IC technology trends: Microarchitecture in IC design

In this latest Siemens EDA 3D IC podcast episode, we explore microarchitecture’s crucial role in 3D IC design. Listen in...

By John McMillan

Electronic Systems Design

Leveraging market-ready PCB design solutions for efficient design phases - Part 1: Understanding the time-to-market advantage

What if your design team could cut development time in half while improving product quality? In today's fast-paced electronics industry, the ability to optimize time-to-market isn't just convenient—it's essential for survival and success.

By David Haboud

Semiconductor Packaging

🎧 Subscribe to the 3D IC podcast — your front row seat to the future of chip design

Listen now on your favorite platform: 🔹 Spotify🔹 Apple Podcasts🔹 Amazon Music🔹 YouTube Playlist 👉 Don’t forget to bookmark the...

By John McMillan

Electronic Systems Design

Closing the gap: How Manufacturing-Driven Design is transforming PCB engineering

Previously on episode 24 of the Printed Circuit Podcast, host Steph Chavez brought together two seasoned experts—Max Clark, Product Strategy...

Electronic Systems Design

Designing smarter, not harder: Embracing PCB design automation in PCB engineering

Previously on the premiere episode of Season 3 of the Printed Circuit Podcast, host Steph Chavez sat down with John...

Cre8Ventures (Siemens EDA)

SpinEdge Joins the Siemens Cre8Ventures Digital Twin Marketplace

We’re thrilled to announce that SpinEdge.ai, a breakthrough Israeli semiconductor startup, has officially joined the Siemens Cre8Ventures Digital Twin Marketplace....

By Carson Bradbury

Electronic Systems Design

Avoid overspending on stackup materials in your PCBs - 8 high speed materials to consider

PCB material discussions are often focused around stackup material selection. These tend to be framed by questions like: ‘We use material ‘x’ for our designs and really like it. What do you think of it?’ This often veils the real question which is: ‘Do you know a good alternative to it?’

By Patrick Hope

Electronic Systems Design

Introducing Xpedition Standard: Scalable PCB design power for growing teams

We are proud to announce the launch of Xpedition Standard, a transformative PCB design solution that delivers the power of the industry-leading Xpedition technology in a scalable, cost-efficient package tailored for growing teams.

By David Haboud