Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Inside Bengaluru’s semiconductor hub: Key highlights from the Solido Custom IC Forum 2026

October 05, 2026

Highlights from Solido Custom IC Forum 2026: AI-powered innovations, agentic EDA workflows and frontline custom chip design and verification

By Mamoona Ahmad

Semiconductor Packaging

Scaling 3D IC design: Trends, challenges and practical workflows

October 05, 2026

Part 1: The reticle limit, advanced packaging and the multiphysics challenge Authors: Kevin Rinebold and Andras Vass-Varnai, Ph.D. This blog...

By John McMillan

Calibre IC Design & Manufacturing

Solving the extraction challenges of CFET and backside power

September 30, 2026

By Karen Chow, Sheetal Veronica, and Kunjesh Agashiwala Introduction: The vertical evolution of semiconductor architecture Both complementary field-effect transistor (CFET)...

Electronic Systems Design

Digital PCB manufacturing handoff for seamless production

September 24, 2026

For years, we have referred to the transition from PCB design into manufacturing as a PCB manufacturing “handoff.” Engineering completes...

By Stephen V. Chavez

Semiconductor Packaging

Beyond the limits of silicon: Why 3D IC is the next frontier of innovation

September 17, 2026

Guest author: Bob Patti, President of NHanced Semiconductors For decades, the semiconductor industry followed a predictable rhythm: shrink the transistors,...

Semiconductor Packaging

Streamlining 3D IC design with Innovator3D IC product family release 2604.0004

September 02, 2026

Release 2604.0004 (available now on Support Center) brings a number of design capabilities and productivity enhancements further enhancing Innovator3D IC...

By Keith Felton

Calibre IC Design & Manufacturing

How shift-left memory contention analysis protects performance and schedule

September 01, 2026

Detect memory contention at the schematic level, optimize memory design and improve reliability with Insight Analyzer—advanced analysis for complex memory blocks

By Calibre IC Design & Manufacturing

Calibre IC Design & Manufacturing

Manufacturing Intelligence: AI in the Fab

September 01, 2026

Discover how AI is fundamentally transforming semiconductor manufacturing, moving beyond traditional limits. Learn how AI tightens feedback loops, tackles bottlenecks, and orchestrates fab operations for unprecedented efficiency and innovation.

By Calibre IC Design & Manufacturing

Semiconductor Packaging

Two systems, one goal: understanding PLM vs. IPLM in 3D IC design

September 01, 2026

Guest author: Vishal Moondhra, VP of Solutions Engineering for Perforce IPLM Your team just made a critical design change to...