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Automotive electronics solutions at AESIN Conference 2021

A successful Automotive Electronics Innovation (AESIN) conference at the UK’s National Motorcycle Museum in Solihull…

Webinar: Reversible Scan Chain Technology Improves Diagnosis Resolution by 4X

Join Siemens and Qualcomm experts for a live, one-hour, online seminar: A Novel Reversible Scan…

Tessent scan diagnosis at IPFA

IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2021) is…

DFT webinar: A new method to find and optimize the most effective test patterns

Choosing the most efficient test patterns and setting coverage targets has always been a challenge…

Tessent at 2021 Automotive Electronics Innovation (AESIN) Conference

Siemens is a headline sponsor of the 2021 Automotive Electronics Innovation (AESIN) Conference taking place…

DFT and the competitive edge

Smart DFT for quality and TTM Don’t let your plans for successful new SoCs be…

Tessent at the 2021 AI Hardware Summit

Don’t miss the AI Hardware Summit from September 13-16, 2021. The summit is THE place…

Webinar: Building AI Chips that Deliver

Experts from Siemens, Groq, Hewlett Packard Enterprise, and Mythic team up to discuss AI chip…

Don’t miss it: Automotive Test and Reliability at ITC-Asia 2021

At the 2021 IEEE International Test Conference, Tessent experts are presenting on bringing 1149.10 to…