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DFT and the competitive edge

Smart DFT for quality and TTM Don’t let your plans for successful new SoCs be…

Tessent at the 2021 AI Hardware Summit

Don’t miss the AI Hardware Summit from September 13-16, 2021. The summit is THE place…

Webinar: Building AI Chips that Deliver

Experts from Siemens, Groq, Hewlett Packard Enterprise, and Mythic team up to discuss AI chip…

Don’t miss it: Automotive Test and Reliability at ITC-Asia 2021

At the 2021 IEEE International Test Conference, Tessent experts are presenting on bringing 1149.10 to…

Tessent at 2021 ITC-Asia

The 2021 IEEE International Test Conference is a virtual event this year, streaming live to…

Webinar – Optimize manycore AI and ML designs

Turn complexity into a competitive advantage by harnessing system-level data to optimize manycore AI and…

Tessent SystemInsight: simultaneous analysis of hardware and software in complex SoC designs

Newly renamed and upgraded, the Tessent™ SystemInsight integrated development environment (IDE) now supports cycle-accurate processor…

Manage automotive test, safety, and security with a safety island

The makers of automotive ICs are living in “interesting times.” These ICs no longer only run…

Join Tessent at the VOICE Developer Conference

Tessent invites you to join us at the upcoming VOICE Developer Conference happening virtually from…