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DFT webinar: A new method to find and optimize the most effective test patterns

Choosing the most efficient test patterns and setting coverage targets has always been a challenge and becomes even more daunting…

Tessent at 2021 Automotive Electronics Innovation (AESIN) Conference

Siemens is a headline sponsor of the 2021 Automotive Electronics Innovation (AESIN) Conference taking place at the UK’s National Motorcycle…

DFT and the competitive edge

Smart DFT for quality and TTM Don’t let your plans for successful new SoCs be derailed by a lack of…

Tessent at the 2021 AI Hardware Summit

Don’t miss the AI Hardware Summit from September 13-16, 2021. The summit is THE place for those acceleratingAI workloads in…

Webinar: Building AI Chips that Deliver

Experts from Siemens, Groq, Hewlett Packard Enterprise, and Mythic team up to discuss AI chip design and deployment. Please join…

Don’t miss it: Automotive Test and Reliability at ITC-Asia 2021

At the 2021 IEEE International Test Conference, Tessent experts are presenting on bringing 1149.10 to life, progress in scan test…

Tessent at 2021 ITC-Asia

The 2021 IEEE International Test Conference is a virtual event this year, streaming live to the world from Wednesday, August…

Webinar – Optimize manycore AI and ML designs

Turn complexity into a competitive advantage by harnessing system-level data to optimize manycore AI and ML chips. Our new on-demand…

Tessent SystemInsight: simultaneous analysis of hardware and software in complex SoC designs

Newly renamed and upgraded, the Tessent™ SystemInsight integrated development environment (IDE) now supports cycle-accurate processor trace and a range of…