Automotive devices need effective control and monitoring as the amount of content for safety, reliability, and security increases. Siemens presents an embedded CPU and software-controlled implementation for automotive devices called a “safety island.”
Siemens EDA and the Tessent group are long-term partners of Samsung foundry and original members of the Samsung advanced foundry ecosystem (SAFE). Tessent is excited to be part of the SAFE events this year running back to back in San Jose and Korea. Register for the SAFE™ Forum, June 28, 2023 to hear Lee Harrison present on the topic of in-life safety, reliability, and security with a focus on automotive.
Using a safety island along with Tessent in-system test technology helps Samsung customers address functional safety requirements in the development of automotive ICs. The presentation explores the concepts around a typical safety island implementation along with examples.
Also showcased at the Siemens booth will be the recently released Tessent Multi-die product, which paves the way for 2.5D and 3D multi-die designs by simplifying critical design-for-test tasks for next-generation ICs. You can also learn about the market leading bus-based packetized test solution, SSN (Streaming Scan network) for ATPG. Talk to our experts at the Siemens EDA booth at these SAFE Forum in San Jose and Korea to learn how Siemens and Samsung work together to address the test, safety and security requirements of you next IC design project.
About the SAFE program: “The SAFE™ program ensures deep collaboration between the Samsung Foundry, ecosystem partners, and customers to deliver competitive and robust System on Chip (SoC) designs based on certified key design components including Process Design Kit (PDK), reference flows with Design Methodologies (DM), Intellectual Property (IP), and ASIC design support.”
Register for the SAFE forum now.
To learn more about the Tessent safety island, download the white paper Automotive safety island.