Airbus Helicopters H160 ANH

Airbus Helicopters: simulation and virtual aircraft

We sat down with Nicolas Damiani, an expert in simulation and operational analysis with Airbus Helicopters, to talk about the future of digitalization.

Crack propagation in composites and how to avoid it: A DLR case study

Ceramic matrix composites (CMCs) have become especially popular in space applications due to their ability to withstand extremely high temperatures. At the German Aerospace Center (DLR), researchers are investigating the use of CMC components for high-temperatures and demanding-environment applications.

Simcenter FLOEFD: CFD for Design-Engineers – Part 4

This is Part 4 of a 4-part series explaining the technology behind Simcenter FLOEFD. Here I will aim to demonstrate…

Simcenter FLOEFD for the engineer - Nuclear reactor

Simcenter FLOEFD: CFD for Design-Engineers – Part 3

Engineers today need practical CFD to solve increasingly complex heat transfer problems to meet strict performance and regulatory demands

Simcenter FLOEFD Designer Stack optimisation Example

Simcenter FLOEFD: CFD for Design-Engineers – Part 2

This is Part 2 of a 4-part series explaining the technology behind Simcenter FLOEFD. Here we will discuss how these…

MAB in engineering: A Hyundai Motor Company case study

Balance is everything In the engineering world, performance targets are often in conflict. For example, a lightweight design might offer…

Female mine official supervises work

How sound source localization helps save miners’ hearing

Read about how the University of Pretoria helped save miners’ hearing in South Africa with Simcenter Sound Camera sound source localization. Read the case study.

MCAM achieves hybrid additive manufacturing strategy for new medical device mold

Medical device validation In the medical device industry, validating a single new part can take up to three years. The…

Simcenter Flotherm ΔTJ Award

Simcenter Flotherm ΔTJ Award Winners

The winners of the Simcenter Flotherm ΔTJ (DeltaTj) Award for Excellence in Electronics Thermal Design have been announced