Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

eTopus and Siemens partner on advanced transceivers taking mainstage at TSMC OIP 2022

November 06, 2022

Thanks to TSMC’s initiative and organization, their 2022 North America OIP (Open Innovation Platform) Ecosystem Forum at Santa Clara convention...

By Pradeep Thiagarajan

Semiconductor Packaging

The five keys to next-generation IC packaging design: Part 3

November 03, 2022

Scalability and range of IC packaging design solutions In my last blog, I talked about multi-domain and cross-domain integration that...

By Keith Felton

Electronic Systems Design

Introduction to the new PCB design best practices series

November 02, 2022

Are you a PCB designer, an electrical engineer, or someone else involved with printed circuit engineering looking to optimize the...

By Stephen V. Chavez

Calibre IC Design & Manufacturing

AUA announces extension of collaboration with Siemens for advanced research and academic enhancement

October 31, 2022

Back in 2012, the American University of Armenia (AUA) initiated a collaborative relationship with electronic design automation (EDA) leader Mentor...

By Calibre IC Design & Manufacturing

Tessent Solutions

Message-based connections enable system-level debug and validation

October 28, 2022

Secure Message Infrastructure is a scalable, message-based on-chip communications fabric that facilitates system-level debug and validation by allowing configuration of on-chip Embedded Analytics IP, cross-triggering and data capture

By andy.gothard

Electronic Systems Design

Variant management in the PCB design process

October 28, 2022

It’s typical for today’s electronic products to have different producible versions or variants. This is because a product may need...

Semiconductor Packaging

Importance of early planning for interconnect verification in 3D IC physical design workflows

October 24, 2022

In our last podcast on 3D IC architecture workflows, we discussed how a system or microarchitectures determine how to partition...

By Heather George

Tessent Solutions

How to master DFT for tile-based designs

October 23, 2022

Hierarchical designs that are tile-based or abutment based physical blocks are predominant in today’s chips. Having no logic present at the chip-level calls for new approaches to testing these tile-based architectures. How a design for test (DFT) architecture can support tile-based designs is the focus of this presentation from U2U 2022.

By Tessent Solutions

Tessent Solutions

Explore a new way to measure heterogenous SoC performance at the Linley Fall Processor Conference

October 22, 2022

Join Siemens at the Linley Fall Processor Conference, the two-day event focusing on processors and IP cores used in embedded, communications, automotive, IoT, and server designs.

By Tessent Solutions