Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Semiconductor Packaging

High Bandwidth Memory (HBM): Unleashing the power of next-gen memory technology

September 28, 2023

In the ever-evolving realm of semiconductor technology, one innovation stands out above the rest: High Bandwidth Memory (HBM). Offering unparalleled...

By Edward Hudson

Electronic Systems Design

Catch the highlights! On-demand video of our PCBflow annual 2023 webinar now available

September 23, 2023

Missed our groundbreaking PCBflow webinar on September 13th? Don’t worry; we’ve got you covered! We’re excited to announce that the...

By Yaron Tayar, lydiatokmakidou

Calibre IC Design & Manufacturing

Transistor-level EMIR analysis from custom design tools? It’s all about flexibility!

September 20, 2023

By Roger Kang How do you run transistor-level electromigration and voltage drop (EMIR) analysis—command line or an interactive invocation GUI?...

By Calibre IC Design & Manufacturing

Electronic Systems Design

PCB design best practices: FPGA/PCB co-design

September 20, 2023

The next best practice in the model-based systems engineering pillar is FPGA/PCB co-design and optimization. What is FPGA/PCB co-design? FPGA/PCB...

By Stephen V. Chavez

Semiconductor Packaging

What’s new in Xpedition IC Packaging VX.2.14

September 19, 2023

The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package...

By Keith Felton

Electronic Systems Design

What’s new in HyperLynx VX.2.14

September 19, 2023

The new VX.2.14 release of HyperLynx contains improvements across: HyperLynx DRC HyperLynx DRC includes a new via length rule that...

By Todd Westerhoff

Electronic Systems Design

What’s new in Xpedition VX.2.14

September 19, 2023

The new VX.2.14 release of Xpedition Enterprise includes improvements to design capture, multi-board systems design, library and design data management,...

Electronic Systems Design

What's new in PADS Professional VX.2.14

September 19, 2023

PADS Professional is the best-in-class PCB design and analysis software for individuals and small workgroups. The PADS Professional desktop is...

Electronic Systems Design

How to Optimize PCB Design for the SMT Assembly Process Flow

September 19, 2023

PCB (Printed Circuit Board) design layout optimization is critical for the success of SMT (Surface Mount Technology) assembly. SMT assembly involves placing surface mount components directly onto the surface of the PCB, as opposed to through-hole components, which require holes to be drilled through the PCB. SMT assembly is faster, more precise, and more cost-effective than through-hole assembly, but it requires careful design optimization to ensure a successful assembly process.