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More Than Moore: Finally Crossing the Chasm?

More Than Moore: Finally Crossing the Chasm?

February 15, 2016

By Michael White, Mentor Graphics Will fan-out wafer-level packaging be the impetus that pushes 3D-IC into mainstream acceptance?  

By Calibre IC Design & Manufacturing
6 MIN READ
An Automated Solution for Voltage-Aware DRC

An Automated Solution for Voltage-Aware DRC

February 2, 2016

By Dina Medhat, Mentor Graphics Automated voltage propagation with Calibre PERC makes it easier to comply with voltage-aware DRC spacing…

By Calibre IC Design & Manufacturing
4 MIN READ
Resetting Expectations on Multi-Patterning Decomposition and Checking Part 2

Resetting Expectations on Multi-Patterning Decomposition and Checking Part 2

January 25, 2016

By David Abercrombie, Mentor Graphics Triple and quadruple patterning can baffle even the most experienced designers. David Abercrombie has some…

By Calibre IC Design & Manufacturing
12 MIN READ
Electromigration and IC Reliability Risk

Electromigration and IC Reliability Risk

January 19, 2016

By Dina Medhat, Mentor Graphics Gradual damage from electromigration can affect product performance and reduce product lifetimes. Reliability analysis ensures…

By Calibre IC Design & Manufacturing
5 MIN READ
You’re Not Alone

You’re Not Alone

January 12, 2016

By Srinivas Velivala, Mentor Graphics Calibre How-To videos replace your roadblocks with fast solutions for tricky verification problems

By Calibre IC Design & Manufacturing
4 MIN READ
Resetting Expectations on Multi-Patterning Decomposition and Checking

Resetting Expectations on Multi-Patterning Decomposition and Checking

December 28, 2015

By David Abercrombie, Mentor Graphics Some common misconceptions about multi-patterning processes and just how they work.

By Calibre IC Design & Manufacturing
9 MIN READ
LEF/DEF IO Ring Check Automation

LEF/DEF IO Ring Check Automation

December 15, 2015

By Matthew Hogan, Mentor Graphics Designing today’s complex system-on-chips (SoCs) requires careful consideration when planning input/output (IO) pad rings…  

By Calibre IC Design & Manufacturing
5 MIN READ
Correct by Construction and Other Myths

Correct by Construction and Other Myths

December 8, 2015

By Joseph Davis, Mentor Graphics Is “correct by construction” a myth?

By Calibre IC Design & Manufacturing
5 MIN READ
Why Do We Need Assembly Design Kits for Packages?

Why Do We Need Assembly Design Kits for Packages?

December 1, 2015

By John Ferguson and Tarek Ramadan, Mentor Graphics Why do we need assembly design kits for IC packages?

By Calibre IC Design & Manufacturing
4 MIN READ